Opendata, web and dolomites

PRIME SIGNED

Ultra-Low PoweR technologIes and MEmory architectures for IoT

Total Cost €

0

EC-Contrib. €

0

Partnership

0

Views

0

Project "PRIME" data sheet

The following table provides information about the project.

Coordinator
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM 

Organization address
address: KAPELDREEF 75
city: LEUVEN
postcode: 3001
website: www.imec.be

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Belgium [BE]
 Project website http://www.prime-h2020.eu
 Total cost 38˙296˙264 €
 EC max contribution 12˙038˙776 € (31%)
 Programme 1. H2020-EU.2.1.1.7. (ECSEL)
 Code Call H2020-ECSEL-2015-1-RIA-two-stage
 Funding Scheme ECSEL-RIA
 Starting year 2015
 Duration (year-month-day) from 2015-12-01   to  2019-09-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) coordinator 3˙116˙585.00
2    GLOBALFOUNDRIES Dresden Module One LLC & Co. KG DE (Dresden) participant 2˙936˙049.00
3    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) participant 1˙013˙123.00
4    TECHNISCHE UNIVERSITAET DRESDEN DE (DRESDEN) participant 977˙842.00
5    STICHTING IMEC NEDERLAND NL (EINDHOVEN) participant 688˙361.00
6    IDT EUROPE GMBH DE (DRESDEN) participant 560˙248.00
7    CEZAMAT PW SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA PL (WARSZAWA) participant 450˙000.00
8    SURECORE LTD UK (LEEDS) participant 425˙437.00
9    SYNOPSYS NETHERLANDS BV NL (EINDHOVEN) participant 379˙609.00
10    DREAM CHIP TECHNOLOGIES GMBH DE (GARBSEN) participant 335˙625.00
11    STMICROELECTRONICS SA FR (MONTROUGE) participant 320˙795.00
12    SOITEC SA FR (BERNIN) participant 210˙625.00
13    STMICROELECTRONICS ROUSSET SAS FR (ROUSSET) participant 201˙334.00
14    INTRINSIC ID B.V. NL (EINDHOVEN) participant 140˙400.00
15    BUBBLES AND BEYOND GMBH DE (LEIPZIG) participant 129˙375.00
16    TECHNOLUTION BV NL (GOUDA) participant 125˙865.00
17    Singulus Technologies AG DE (KAHL AM MAIN) participant 27˙500.00

Map

 Project objective

The goal of the PRIME project is to establish an open Ultra Low Power (ULP) Technology Platform containing all necessary design and architecture blocks and components which could enable the European industry to increase and strengthen their competitive and leading eco-system and benefit from market opportunities created by the Internet of Things (IoT) revolution. Over 3 years the project will develop and demonstrate the key building blocks of IoT ULP systems driven by the applications in the medical, agricultural, domestics and security domains. This will include development of high performance, energy efficient and cost effective technology platform, flexible design ecosystem (including IP and design flow), changes in architectural and power management to reduced energy consumption, security blocks based on PUF and finally the System of Chip and System in Package memory banks and processing implementations for IoT sensor node systems. Developped advanced as 22nm FDSOI low power technologies with logic, analog, RF and embedded new memory components (STT RAM and RRAM) together with innovative design and system architecture solutions will be used to build macros and demonstrate functionality and power reduction advantage of the new IoT device components. The PRIME project will realize several demonstrators of IoT system building blocks to show the proposed low power wireless solutions, functionality and performance of delivered design and technology blocks. The consortium semiconductor ecosystem (IDMs, design houses, R&D, tools & wafer suppliers, foundries, system/product providers) covers complementarily all desired areas of expertise to achieve the project goals. The project will enable an increase in Europe’s innovation capability in the area of ULP Technology, design and applications, creation of a competitive European eco-system and help to identify market leadership opportunities in security, mobility, healthcare and smart cost competitive manufacturing.

 Deliverables

List of deliverables.
Public communication of final result Other 2020-02-12 17:41:42
Web page Other 2019-09-10 08:57:16

Take a look to the deliverables list in detail:  detailed list of PRIME deliverables.

 Publications

year authors and title journal last update
List of publications.
2017 Kalishetthyhalli Mahadevaiah, Mamathamba
PVD and ALD process development of advanced oxide-based RRAM-stacks
published pages: , ISSN: , DOI:
2019-12-17
2020 Elbert Bechthum, Johan Dijkhuis, Ming Ding, Yuming He, Johan van den Heuvel, Paul Mateman, Gert-Jan van Schaik, Kenichi Shibata*, Minyoung Song, Evgenii Tiurin, Stefano Traferro, Nick Winkel, Yao-Hong Li, Christian Bachmann
A low-power BLE transceiver with support for phase-based ranging, featuring 5μs PLL locking time and 5.3ms ranging time, enabled by staircase-chirp PLL with sticky-lock channel-switching
published pages: , ISSN: , DOI:
2020 International Solid-State Circuits Conference 2019-12-17
2019 Mattis Hasler, Robert Wittig, Emil Matus, Gerhard Fettweis
Slicing FIFOs for On-Chip Memory Bandwidth Exhaustion
published pages: 1-10, ISSN: 1549-8328, DOI: 10.1109/tcsi.2019.2926134
IEEE Transactions on Circuits and Systems I: Regular Papers Print ISSN: 1549-8328 Electroni 2019-12-17
2019 W. Schwarzenbach, B.-Y. Nguyen, L. Ecarnot, S. Loubriat, M. Detard, E. Cela, C. Bertrand-Giuliani, G. Chabanne, C. Maddalon, N. Daval, C. Maleville
Advanced FD-SOI and Beyond Low Temperature SmartCutâ„¢ Enables High Density 3-D SoC Applications
published pages: 863-868, ISSN: 2168-6734, DOI: 10.1109/jeds.2019.2916460
IEEE Journal of the Electron Devices Society 7 2019-12-17
2019 Hua Lv, João Fidalgo, Diana C. Leitão, Ana V. Silva, Thomas Kämpfe, Stefan Riedel, Juergen Langer, Jerzy Wrona, Berthold Ocker, Paulo P. Freitas, Susana Cardoso
The annealing effect on memory state stability and interlayer coupling in perpendicular magnetic tunnel junctions with ultrathin MgO barrier
published pages: 142-146, ISSN: 0304-8853, DOI: 10.1016/j.jmmm.2019.01.050
Journal of Magnetism and Magnetic Materials 477 2019-12-17
2019 M Hasler, R Wittig, E Matus, G Fettweis
A Hybrid Execution Approach to Improve the Performance of Dataflow Applications
published pages: , ISSN: , DOI:
16th International SoC Design Conference 2019-12-17
2019 Maciej Haras, Michał Markiewicz, Stéphane Monfray, Thomas Skotnicki
Pulse mode of operation – A new booster of TEG, improving power up to X2.7 – to better fit IoT requirements
published pages: 104204, ISSN: 2211-2855, DOI: 10.1016/j.nanoen.2019.104204
Nano Energy In Press 2019-12-17
2019 S Nam, E Matus, G Fettweis
Application Specific Instruction Processor for Dynamic Connection Allocation in TDM-NoCs
published pages: , ISSN: , DOI:
32th IEEE International System-On-Chip Conference 2019-12-17
2017 S Haas, G Fettweis
Energy-Efficient Hash Join Implementations in Hardware-Accelerated MPSoCs
published pages: , ISSN: , DOI:
Eighth International Workshop on Accelerating Analytics and Data Management Systems Using Modern Processor and Storage Architectures Eighth International Workshop o 2019-12-17
2018 Hua Lv, Diana C. Leitao, Zhiwei Hou, Paulo P. Freitas, Susana Cardoso, Thomas Kämpfe, Johannes Müller, Juergen Langer, Jerzy Wrona
Barrier breakdown mechanism in nano-scale perpendicular magnetic tunnel junctions with ultrathin MgO barrier
published pages: 55908, ISSN: 2158-3226, DOI: 10.1063/1.5007656
AIP Advances 8/5 2019-09-10
2017 Benjamin Prautsch, Uwe Eichler, Torsten Reich, Jens Lienig
MESH: Explicit and Flexible Generation of Analog Arrays
published pages: , ISSN: , DOI:
International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) annually 2019-09-10

Are you the coordinator (or a participant) of this project? Plaese send me more information about the "PRIME" project.

For instance: the website url (it has not provided by EU-opendata yet), the logo, a more detailed description of the project (in plain text as a rtf file or a word file), some pictures (as picture files, not embedded into any word file), twitter account, linkedin page, etc.

Send me an  email (fabio@fabiodisconzi.com) and I put them in your project's page as son as possible.

Thanks. And then put a link of this page into your project's website.

The information about "PRIME" are provided by the European Opendata Portal: CORDIS opendata.

More projects from the same programme (H2020-EU.2.1.1.7.)

APPLAUSE (2019)

Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe

Read More  

PIN3S (2019)

Pilot Integration of 3nm Semiconducter technology

Read More  

HELIAUS (2019)

tHErmaL vIsion AUgmented awarenesS

Read More