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INTERSTELLAR SIGNED

Building the next generation high-speed data converters to strengthen European excellence and competitiveness on space applications and beyond

Total Cost €

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EC-Contrib. €

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Partnership

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Project "INTERSTELLAR" data sheet

The following table provides information about the project.

Coordinator
TELEDYNE E2V SEMICONDUCTORS SAS 

Organization address
address: AVENUE DE ROCHEPLEINE
city: SAINT EGREVE
postcode: 38120
website: http://www.e2v.com

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country France [FR]
 Project website http://www.h2020-interstellar.eu
 Total cost 7˙309˙500 €
 EC max contribution 6˙201˙187 € (85%)
 Programme 1. H2020-EU.2.1.6.2. (Enabling advances in space technology)
2. H2020-EU.2.1.6.1.1. (Safeguard and further develop a competitive, sustainable and entrepreneurial space industry and research community and strengthen European non-dependence in space systems)
 Code Call H2020-COMPET-2016
 Funding Scheme RIA
 Starting year 2016
 Duration (year-month-day) from 2016-12-01   to  2021-09-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    TELEDYNE E2V SEMICONDUCTORS SAS FR (SAINT EGREVE) coordinator 3˙746˙250.00
2    THALES ALENIA SPACE FRANCE SAS FR (TOULOUSE) participant 1˙232˙371.00
3    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) participant 849˙980.00
4    AIRBUS ITALIA SPA IT (ROMA) participant 284˙313.00
5    AIRBUS DEFENCE AND SPACE LTD UK (STEVENAGE) participant 69˙522.00
6    KAPITECH SP ZOO PL (WARSZAWA) participant 18˙750.00

Map

 Project objective

The proposed INTERSTELLAR project addresses one critical topic of European non-dependence under the line “High speed DAC-ADC based on European Technology” – analogue-to-digital and digital-to-analogue data converters. E2V designs, manufactures, supplies to the space market these essential components, but faces keen competition from US providers. To preserve know-how and production of such competitive components in Europe and to underscore its efforts for non-dependence, the industrial consortium proposes to develop two new data converters and to mature them to TRL6. A four-channel ADC, sampling at up to 6 GSPs offers ultra-wide input bandwidth, flexibility and high-speed serial outputs. A multi-channel DAC, reconstructing at up to 6 GSPs offers multi-Nyquist output bandwidth, configurable modes and high-speed serial inputs. Using a European semiconductor technology, the new converters shall target performances beyond today’s state-of-the-art to ensure their competitiveness by their delivery dates. Such devices facilitate innovative Rx-to-Tx signal chain solutions for satellite telecommunications, earth observation, navigation and scientific missions. To achieve the challenging objectives set, the four partners have intimate knowledge in space technology and will bring expertise to the project. E2V (F), coordinator, will be in charge of design, manufacturing and test activities. AIRBUS Defence & Space (UK) and THALES ALENIA SPACE (F), the two major European space companies, will make a key contribution as end-users of space data converters – guiding initial requirements and evaluating the devices under relevant conditions. The Fraunhofer Institute (D) will significantly contribute with reference PCBs hosting the new ADC and DAC, thus enabling detailed device evaluation and enhancing the dissemination of the results. Assembling such honed skills within a fruitful cooperation, promises to make the INTERSTELLAR project a great success for the European space industry.

 Deliverables

List of deliverables.
Project website Websites, patent fillings, videos etc. 2019-10-03 19:21:33

Take a look to the deliverables list in detail:  detailed list of INTERSTELLAR deliverables.

 Publications

year authors and title journal last update
List of publications.
2018 Romain Pilard; Matthieu Martin; Benoit Dervaux; Khaled Salmi; Gregory Wagner;
Prototype of a MultiMode C-Band Capable 12-bit 1.5/3/6 GSps Quad ADC in Flip-Chip Non-Hermetic Technology
published pages: , ISSN: , DOI:
AMICSA 2018 Proceedings June 2018 2019-10-03

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The information about "INTERSTELLAR" are provided by the European Opendata Portal: CORDIS opendata.

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