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APPLAUSE SIGNED

Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe

Total Cost €

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EC-Contrib. €

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Partnership

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Project "APPLAUSE" data sheet

The following table provides information about the project.

Coordinator
ICOS VISION SYSTEMS NV 

Organization address
address: ESPERANTOLAAN 8C
city: HEVERLEE
postcode: 3001
website: www.kla-tencor.com

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Belgium [BE]
 Total cost 34˙558˙714 €
 EC max contribution 8˙561˙598 € (25%)
 Programme 1. H2020-EU.2.1.1.7. (ECSEL)
 Code Call H2020-ECSEL-2018-1-IA-two-stage
 Funding Scheme ECSEL-IA
 Starting year 2019
 Duration (year-month-day) from 2019-05-01   to  2022-04-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    ICOS VISION SYSTEMS NV BE (HEVERLEE) coordinator 511˙750.00
2    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) participant 1˙264˙468.00
3    AMS AG AT (UNTERPREMSTAETTEN) participant 698˙450.00
4    BESI AUSTRIA GMBH AT (RADFELD) participant 502˙078.00
5    ALMAE TECHNOLOGIES FR (MARCOUSSIS) participant 448˙500.00
6    ROODMICROTEC GMBH DE (NORDLINGEN) participant 377˙394.00
7    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) participant 347˙053.00
8    DUSTPHOTONICS LTD IL (TEL AVIV - JAFFA) participant 341˙343.00
9    UNIVERSITETET I SOROST-NORGE NO (PORSGRUNN) participant 307˙431.00
10    TURUN YLIOPISTO FI (Turku) participant 299˙105.00
11    SEMILAB FELVEZETO FIZIKAI LABORATORIUM RESZVENYTARSASAG HU (BUDAPEST) participant 297˙600.00
12    EV GROUP E. THALLNER GMBH AT (ST FLORIAN AM INN) participant 276˙918.00
13    INTEGRATED DETECTOR ELECTRONICS AS NO (OSLO) participant 260˙325.00
14    STICHTING IMEC NEDERLAND NL (EINDHOVEN) participant 256˙578.00
15    PRECORDIOR OY FI (TURKU) participant 218˙457.00
16    WURTH ELEKTRONIK GMBH & CO KG DE (NIEDERNHALL) participant 193˙000.00
17    OSYPKA AG DE (RHEINFELDEN BADEN) participant 187˙375.00
18    NUROMEDIA GMBH DE (KOLN) participant 178˙375.00
19    ALBIS OPTOELECTRONICS AG CH (RUSCHLIKON) participant 164˙062.00
20    AFORE OY FI (LIETO) participant 163˙437.00
21    CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT CH (NEUCHATEL) participant 160˙772.00
22    AALTO KORKEAKOULUSAATIO SR FI (ESPOO) participant 160˙030.00
23    Besi Netherlands BV NL (DUIVEN) participant 151˙659.00
24    ADVANCED PACKAGING CENTER BV NL (DUIVEN) participant 141˙062.00
25    Pac Tech - Packaging Technologies GmbH DE (Nauen) participant 128˙250.00
26    ELEKTRONIKAS UN DATORZINATNU INSTITUTS LV (RIGA) participant 113˙050.00
27    VAISALA OYJ FI (VANTAA) participant 108˙464.00
28    JSR MICRO NV BE (LEUVEN) participant 106˙863.00
29    DISCO HI-TEC EUROPE GMBH DE (KIRCHHEIM) participant 105˙350.00
30    OY EVERON AB FI (TURKU) participant 78˙077.00
31    CARDIACCS AS NO (Oslo) participant 14˙312.00

Map

 Project objective

The strong drive for more complex systems and more advanced packaging, including optics and photonics, creates a chance to retain the manufacturing and packaging value chain to Europe - or even start to bring it back. APPLAUSE supports this by building on the European expertise in advanced packaging and assembly to develop new tools, methods and processes for high volume mass manufacturing of electrical and optical components. The technologies will be piloted in 5 industrial Use Cases, related to 1. Substantially smaller 3D integrated ambient light sensor for mobile and wearable applications (AMS) 2. High performance, low cost, uncooled thermal IR sensor for automotive and surveillance applications (IDEAS) 3. High speed Datacom transceivers with reduced manufacturing costs (DustPhotonics) 4. Flexible cardiac monitoring patch and miniaturized cardiac implants with advanced monitoring capabilities (GE Healthcare and Cardiaccs) 6. Optical water measurement modules with cost-effective packaging of components (Vaisala) The APPLAUSE consortium is built of a number of leading experts from European electronics packaging companies representing different value chain levels related to advanced packaging and smart system integration. The parties have complementary expertise in conception, design, packaging, testing and manufacturing of electronic components, as well as a wide range of expertise from several different end use areas. The unique European ecosystem established within the consortium represents the competitive, leading edge of the technologies available.

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The information about "APPLAUSE" are provided by the European Opendata Portal: CORDIS opendata.

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