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ORIGENAL SIGNED

Origami electronics for three dimensional integration of computational devices

Total Cost €

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EC-Contrib. €

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Partnership

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Project "ORIGENAL" data sheet

The following table provides information about the project.

Coordinator
GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH 

Organization address
address: OTTO BLUMENTHAL STRASSE
city: AACHEN
postcode: 52074
website: www.amo.de

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Germany [DE]
 Total cost 2˙743˙800 €
 EC max contribution 2˙743˙800 € (100%)
 Programme 1. H2020-EU.1.2.1. (FET Open)
 Code Call H2020-FETOPEN-2018-2019-2020-01
 Funding Scheme RIA
 Starting year 2019
 Duration (year-month-day) from 2019-10-01   to  2023-09-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    GESELLSCHAFT FUR ANGEWANDTE MIKRO UND OPTOELEKTRONIK MIT BESCHRANKTERHAFTUNG AMO GMBH DE (AACHEN) coordinator 717˙355.00
2    Teknologian tutkimuskeskus VTT Oy FI (Espoo) participant 960˙001.00
3    TECHNISCHE UNIVERSITAET WIEN AT (WIEN) participant 631˙159.00
4    UNIVERSITA DI PISA IT (PISA) participant 435˙285.00

Map

 Project objective

Increasing the integrated circuits complexity by lateral scaling, known as Moore’s law, was the major driving force for the semiconductor industry. Now, after more than 4 decades down scaling is approaching fundamental and also economic limitations, and new solutions for further increasing the transistor count are explored. Utilizing the third dimension in chip architecture is one of the most promising directions. However, current solutions like wafer-to-wafer stacking will only deliver solutions for the short term with maximum some tens of layers on-top of each other’s. In the ORIGENAL project we propose a radically new approach to address the challenge of ultra-dense 3D integration of CMOS devices by using a thin-film-transistor (TFT) technology on thin foil substrate and the subsequent topological folding in order to achieve a dense 3D packaging with completely new integration architectures. This radically new approach will enable the stacking of thousands of layers on top of each other’s, each containing state-of-the-art CMOS circuits and thus will provide enough fuel to further increase the transistor count on a chip according to Moore’s law for more than 30 years. In addition, new computing concepts like neuromorphic computing will significantly benefit from the highly interconnected architecture developed in this project. The proposal focuses on the development of a suitable thin-film-transistor technology on ultrathin-foil, the 3D interconnect and architecture, and the required technology for high precision folding. Achieving the ambitious objectives requires an interdisciplinary approach including contributions from Material science, electrical engineering, mechanical engineering, biology, physics and chemistry. The proposed forefront research will not only lay the foundations for a new line of technology, but also open up an opportunity to reinforce the technological leadership of European players.

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The information about "ORIGENAL" are provided by the European Opendata Portal: CORDIS opendata.

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