SUCCESS

Silicon-based Ultra-Compact Cost-Efficient System Design for mm-Wave Sensors

 Coordinatore  

 Organization address address: IM TECHNOLOGIEPARK 25 25
city: FRANKFURT (ODER)
postcode: 15236

contact info
Titolo: Mr.
Nome: Uwe
Cognome: George
Email: send email
Telefono: 493356000000
Fax: 493356000000

 Nazionalità Coordinatore Non specificata
 Totale costo 4˙720˙836 €
 EC contributo 29˙895 €
 Programma FP7-ICT
Specific Programme "Cooperation": Information and communication technologies
 Anno di inizio 2009
 Periodo (anno-mese-giorno) 2009-12-01   -   2013-05-31

 Partecipanti

# participant  country  role  EC contrib. [€] 
1    IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK

 Organization address address: IM TECHNOLOGIEPARK 25 25
city: FRANKFURT (ODER)
postcode: 15236

contact info
Titolo: Mr.
Nome: Uwe
Cognome: George
Email: send email
Telefono: 493356000000
Fax: 493356000000

DE (FRANKFURT (ODER)) coordinator 0.00
2    Evatronix IP Spolka z ograniczona odpowiedzialnoscia

 Organization address address: Przybyly
city: Bielsko-Biala
postcode: 43-300

contact info
Titolo: Mr.
Nome: Piotr
Cognome: Penkala
Email: send email
Telefono: 48694929229

PL (Bielsko-Biala) participant 0.00
3    HIGHTEC MC AG

 Organization address address: FABRIKSTRASSE
city: LENZBURG
postcode: 5600

contact info
Titolo: Dr.
Nome: Gerhard
Cognome: Kunkel
Email: send email
Telefono: +41 62 8858550
Fax: +41 62 8858500

CH (LENZBURG) participant 0.00
4    Karlsruher Institut fuer Technologie

 Organization address address: Kaiserstrasse
city: Karlsruhe
postcode: 76131

contact info
Titolo: Ms.
Nome: Simone
Cognome: Gorré
Email: send email
Telefono: +49 721 6087729
Fax: +49 721 691865

DE (Karlsruhe) participant 0.00
5    ROBERT BOSCH GMBH

 Organization address address: Robert-Bosch Platz
city: GERLINGEN-SCHILLERHOEHE
postcode: 70839

contact info
Titolo: Ms.
Nome: Anja
Cognome: Markworth
Email: send email
Telefono: +49 5121 49 5723
Fax: +49 5121 49 4190

DE (GERLINGEN-SCHILLERHOEHE) participant 0.00
6    SELMIC OY

 Organization address address: VEISTAMOTIE
city: OULU
postcode: 90550

contact info
Titolo: Mr.
Nome: Jaska
Cognome: Paaso
Email: send email
Telefono: +358 108202912

FI (OULU) participant 0.00
7    SILICON RADAR GMBH

 Organization address address: IM TECHNOLOGIEPARK
city: FRANKFURT
postcode: 15236

contact info
Titolo: Mrs.
Nome: Anja
Cognome: Bölicke
Email: send email
Telefono: +49 335 557 10 60
Fax: +49 335 557 10 50

DE (FRANKFURT) participant 0.00
8    STMICROELECTRONICS S.A.

 Organization address address: Boulevard Romain Rolland 29
city: MONTROUGE
postcode: 92120

contact info
Titolo: Mr.
Nome: Gilles
Cognome: THOMAS
Email: send email
Telefono: +33 4 76 92 51 11
Fax: +33 4 76 08 81 33

FR (MONTROUGE) participant 0.00
9    THE GOVERNING COUNCIL OF THE UNIVERSITY OF TORONTO

 Organization address address: KINGS COLLEGE CIRCLE 27
city: TORONTO
postcode: M5S 1A1

contact info
Titolo: Ms.
Nome: Krista
Cognome: Montgomery
Email: send email
Telefono: +1 416 978 7118
Fax: +1 416 971 2010

CA (TORONTO) participant 0.00

Mappa


 Word cloud

Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.

silicon    frequency    mm    sip    integration    platform    wave    ghz    device    packaging    form    industrial    realized    miniaturized    size    soc    chip    true   

 Obiettivo del progetto (Objective)

SUCCESS targets to develop a technology platform and best-practice design methods to enable the breakthrough of silicon mm-Wave SoCs for high-volume applications. Silicon technology (CMOS, SiGe) has made tremendous progress towards ever higher device cut-off frequencies. Nowadays all RF components for mm-Wave sensing applications up to 120 GHz can be realized in silicon. Silicon technology hence allows integration of mm-Wave circuitry and digital logic for the realization of a true 'mm-Wave System-on-Chip' (SoC). The mm-wavelengths allow mm-size antennas which potentially enable miniaturized wireless sensors systems with the size and form factor of an IC package. However several challenges make it difficult to arrive at real low cost. Firstly no true low-cost mm-wave packaging technologies with antenna-integration are available. Furthermore challenges in mm-wave SoC design arise in form of imprecise modelling and device variations. In addition production testing at such high-frequency is extremely expensive, time consuming, and error prone. SUCCESS is an initiative of 9 major industrial and excellent academic organisations. It represents a vertically integrated consortium bringing together semiconductor foundries, design houses, high-frequency packaging experts and industrial end users. The consortium encompasses universities, research institutions, SMEs and large industrial entities.nThree topics will be addressed in the project:n1. Development of a low-cost System-In-Package (SiP) technology and design platform with integrated antennasn2. mm-Wave System-on-Chip (SoC) design methodologyn3. mm-Wave Built-In Self Test (BIST) and novel SiP test methodologynThe results will be demonstrated in a 122 GHz miniaturized sensor system, realized as surface mount component using plastic package technology.

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