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TOP HIT SIGNED

Transfer-print operations for heterogeneous integration

Total Cost €

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EC-Contrib. €

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Partnership

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Project "TOP HIT" data sheet

The following table provides information about the project.

Coordinator
UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK 

Organization address
address: WESTERN ROAD
city: Cork
postcode: T12 YN60
website: www.ucc.ie

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Ireland [IE]
 Project website http://www.tophit-ssi.eu/
 Total cost 5˙252˙637 €
 EC max contribution 5˙252˙637 € (100%)
 Programme 1. H2020-EU.2.1.1.1. (A new generation of components and systems: Engineering of advanced embedded and energy and resource efficient components and systems)
 Code Call H2020-ICT-2014-1
 Funding Scheme RIA
 Starting year 2015
 Duration (year-month-day) from 2015-02-02   to  2018-08-01

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK IE (Cork) coordinator 908˙224.00
2    SEAGATE TECHNOLOGY IRELAND UK (LONDONDERRY) participant 1˙146˙250.00
3    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) participant 862˙200.00
4    X-FAB MEMS FOUNDRY GmbH DE (ERFURT) participant 661˙945.00
5    HUAWEI TECHNOLOGIES RESEARCH & DEVELOPMENT BELGIUM BE (GENT) participant 631˙250.00
6    X-CELEPRINT LIMITED IE (DUBLIN) participant 552˙500.00
7    THE CENTRE FOR INTEGRATED PHOTONICS LIMITED UK (IPSWICH, SUFFOLK) participant 490˙268.00

Map

 Project objective

Smart systems technologies are evolving towards ever increasing functionality and miniaturisation through the heterogeneous integration of separate components. The ideal integration requires precision placement of multiple types of devices on a substrate to allow their inter-connection. We propose to solve this integration challenge through an exciting new technique called micro-Transfer-Printing (TP) where the essential materials or devices, with thicknesses of a few microns, are separated from their native substrates and are transferred in parallel to the new platform according to the desired positioning while achieving micron-scale placement accuracy. Sequential application of the process enables different components of different functionality to be manipulated in a highly flexible and programmable way making best use of the materials. The TOP HIT project will aggressively develop and validate the TP technology by integrating electronics and photonics components for the magnetic and communication industries. These serve as examples for the broad capability of the technology which is compatible with low-cost manufacturing. We will develop ‘On Head Microelectronics’ for data storage smart systems through the embedded integration of custom electronic circuits directly into the magnetic read-head. We will demonstrate TP as a scalable method for the integration of compound semiconductor based elements (lasers, detectors) with silicon photonics platforms demonstrating both a compact receiver circuit and a transceiver. The partners in the TOP HIT consortium include international companies with extensive manufacturing capabilities, an SME, and two research institutes. The output of this project will help establish TP as a mainstream technology for heterogeneous integration, enabling manufacturing to be carried out in Europe through sales of equipment and through foundry services.

New more efficient smart products will emerge from the research carried out here.

 Deliverables

List of deliverables.
Plan for access to technology Documents, reports 2019-07-23 10:47:36
Newsletter Documents, reports 2019-07-23 10:47:36

Take a look to the deliverables list in detail:  detailed list of TOP HIT deliverables.

 Publications

year authors and title journal last update
List of publications.
2017 J. O’Callaghan, R. Loi, E. E. Mura, B. Roycroft, A. J. Trindade, K. Thomas, A. Gocalinska, E. Pelucchi, J. Zhang, G. Roelkens, C. A. Bower, B. Corbett
Comparison of InGaAs and InAlAs sacrificial layers for release of InP-based devices
published pages: 4408, ISSN: 2159-3930, DOI: 10.1364/ome.7.004408
Optical Materials Express 7/12 2019-07-23
2016 Sören Dhoore, Sarah Uvin, Dries Van Thourhout, Geert Morthier, and Gunther Roelkens
Novel adiabatic tapered couplers for active III–V/SOI devices fabricated through transfer printing
published pages: 12976-12990, ISSN: 1094-4087, DOI: 10.1364/OE.24.012976
Optics Express 24 (12) 2019-07-23
2018 G. Muliuk, K. Van Gasse, M. Shahin, J. Verbist, A.J. Trindade, B. Corbett, D. Van Thourhout, G. Roelkens
\"4x25Gbit/s Silicon Photonics Tunable Receiver using Transfer Printed III-V Photodiodes\"\",\"
published pages: , ISSN: , DOI:
IEEE Photonics Conference, Reston, VA, USA 2019-07-23
2017 Jing Zhang, Andreas De Groote, Amin Abbasi, Ruggero Loi, James O’Callaghan, Brian Corbett, António José Trindade, Christopher A. Bower, Gunther Roelkens
Silicon photonics fiber-to-the-home transceiver array based on transfer-printing-based integration of III-V photodetectors
published pages: 14290, ISSN: 1094-4087, DOI: 10.1364/OE.25.014290
Optics Express 25/13 2019-07-23
2018 Nan Ye, Grigorij Muliuk, Jing Zhang, Amin Abbasi, Antonio Jose Trindade, Chris Bower, Dries Van Thourhout, Gunther Roelkens
Transfer Print Integration of Waveguide-Coupled Germanium Photodiodes Onto Passive Silicon Photonic ICs
published pages: 1249-1254, ISSN: 0733-8724, DOI: 10.1109/JLT.2017.2777509
Journal of Lightwave Technology 36/5 2019-07-23
2016 Ruggero Loi, James O\'Callaghan, Brendan Roycroft, Cedric Robert, Alin Fecioru, Antonio Jose Trindade, Agnieszka Gocalinska, Emanuele Pelucchi, Christopher A. Bower, Brian Corbett
Transfer Printing of AlGaInAs/InP Etched Facet Lasers to Si Substrates
published pages: 1-10, ISSN: 1943-0655, DOI: 10.1109/JPHOT.2016.2627883
IEEE Photonics Journal 8/6 2019-07-23
2017 Jing Zhang, Yanlu Li, Sören Dhoore, Geert Morthier, Gunther Roelkens
Unidirectional, widely-tunable and narrow-linewidth heterogeneously integrated III-V-on-silicon laser
published pages: 7092, ISSN: 1094-4087, DOI: 10.1364/OE.25.007092
Optics Express 25/6 2019-07-23
2017 Brian Corbett, Ruggero Loi, Weidong Zhou, Dong Liu, Zhenqiang Ma
Transfer print techniques for heterogeneous integration of photonic components
published pages: 1-17, ISSN: 0079-6727, DOI: 10.1016/j.pquantelec.2017.01.001
Progress in Quantum Electronics 52 2019-07-23
2018 Jing Zhang, Bahawal Haq, James O’Callaghan, Angieska Gocalinska, Emanuele Pelucchi, António José Trindade, Brian Corbett, Geert Morthier, Gunther Roelkens
Transfer-printing-based integration of a III-V-on-silicon distributed feedback laser
published pages: 8821, ISSN: 1094-4087, DOI: 10.1364/OE.26.008821
Optics Express 26/7 2019-07-23
2018 Nan Ye, Grigorij Muliuk, Antonio Jose Trindade, Chris Bower, Jing Zhang, Sarah Uvin, Dries Van Thourhout, Gunther Roelkens
High-alignment-accuracy transfer printing of passive silicon waveguide structures
published pages: 2023, ISSN: 1094-4087, DOI: 10.1364/oe.26.002023
Optics Express 26/2 2019-07-23
2018 Ruggero Loi, James O\'Callaghan, Brendan Roycroft, Zhiheng Quan, Kevin Thomas, Agnieszka Gocalinska, Emanuele Pelucchi, Antonio Jose Trindade, Chris Anthony Bower, Brian Corbett
Thermal Analysis of InP Lasers Transfer-printed to Silicon Photonics Substrates
published pages: 1-1, ISSN: 0733-8724, DOI: 10.1109/JLT.2018.2881179
Journal of Lightwave Technology 2019-07-23
2017 G. Muliuk, N. Ye, J. Zhang, A. Abbasi, D. Van Thourhout, G. Roelkens
Transfer Print Integration of 40Gbps Germanium Photodiodes onto Silicon Photonic ICs
published pages: , ISSN: , DOI:
European Conference on Optical Communication, Sweden, p.PDP.C.4 (2017). 2019-07-23
2016 Muliuk, Grigorij, et al.
\"\"\"Transfer printing of silicon-on-insulator devices on silicon nitride waveguide circuits: design of coupling structures and process development.\"\"\"
published pages: , ISSN: , DOI:
Proceedings Symposium IEEE Photonics Society Benelux. 2016. 2019-07-23
2017 Leili Abdollahi Shiramin, Alexandre Bazin, Steven Verstuyft, Sylvia Lycke, Peter Vandenabeele, Gunther Roelkens, Dries Van Thourhout
Transfer Printing of Micron-Size Graphene for Photonic Integrated Circuits and Devices
published pages: P435-P439, ISSN: 2162-8769, DOI: 10.1149/2.0241707jss
ECS Journal of Solid State Science and Technology 6/7 2019-07-23

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