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TOP HIT SIGNED

Transfer-print operations for heterogeneous integration

Total Cost €

EC-Contrib. €

Partnership

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Outcomes and
results

TOP HIT project word cloud

Explore the words cloud of the TOP HIT project. It provides you a very rough idea of what is the project "TOP HIT" about.

silicon circuit custom international output data types photonics precision storage materials read native hit thicknesses accuracy micro few magnetic positioning extensive parallel technique electronic head multiple desired printing sme integrating inter miniaturisation placement platforms transferred demonstrating capability companies transceiver institutes connection mainstream scalable separate services validate broad lasers efficient heterogeneous microelectronics foundry circuits industries substrate platform smart communication compatible separated compact tp technologies aggressively semiconductor receiver integration micron serve detectors examples electronics programmable microns compound emerge components sales ideal flexible transfer substrates sequential manipulated manufacturing

Project "TOP HIT" data sheet

The following table provides information about the project.

Coordinator	UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK Organization address address: WESTERN ROAD city: Cork postcode: T12 YN60 website: www.ucc.ie contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.
Coordinator Country	Ireland [IE]
Project website	http://www.tophit-ssi.eu/
Total cost	5˙252˙637 €
EC max contribution	5˙252˙637 € (100%)
Programme	1. H2020-EU.2.1.1.1. (A new generation of components and systems: Engineering of advanced embedded and energy and resource efficient components and systems)
Code Call	H2020-ICT-2014-1
Funding Scheme	RIA
Starting year	2015
Duration (year-month-day)	from 2015-02-02 to 2018-08-01

Partnership

Take a look of project's partnership.

#	participants	country	role	EC contrib. [€]
1	UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK Organization address address: WESTERN ROAD city: Cork postcode: T12 YN60 website: www.ucc.ie contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IE (Cork)	coordinator	908˙224.00
2	SEAGATE TECHNOLOGY IRELAND SEAGATE TECHNOLOGY IRELAND Organization address address: DISC DRIVE - SPRINGTOWN INDUSTRIAL 1 city: LONDONDERRY postcode: BT48 0BF website: www.seagate.com contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	UK (LONDONDERRY)	participant	1˙146˙250.00
3	INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Organization address address: KAPELDREEF 75 city: LEUVEN postcode: 3001 website: www.imec.be contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (LEUVEN)	participant	862˙200.00
4	X-FAB MEMS FOUNDRY GmbH X-FAB MEMS FOUNDRY GmbH Organization address address: HAARBERGSTR. 67 city: ERFURT postcode: 99097 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	DE (ERFURT)	participant	661˙945.00
5	HUAWEI TECHNOLOGIES RESEARCH & DEVELOPMENT BELGIUM HUAWEI TECHNOLOGIES RESEARCH & DEVELOPMENT BELGIUM Organization address address: TECHNOLOGIEPARK-ZWIJNAARDE 19 AA TOWER city: GENT postcode: 9052 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	BE (GENT)	participant	631˙250.00
6	X-CELEPRINT LIMITED X-CELEPRINT LIMITED Organization address address: 6th Floor, 2 Grand Canal Square city: DUBLIN postcode: 2 website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	IE (DUBLIN)	participant	552˙500.00
7	THE CENTRE FOR INTEGRATED PHOTONICS LIMITED THE CENTRE FOR INTEGRATED PHOTONICS LIMITED Organization address address: B55 ADASTRAL PARK, MARTLESHAM HEATH city: IPSWICH, SUFFOLK postcode: IP5 3RE website: n.a. contact info title: n.a. name: n.a. surname: n.a. function: n.a. email: n.a. telephone: n.a. fax: n.a.	UK (IPSWICH, SUFFOLK)	participant	490˙268.00

Map

Project objective

Smart systems technologies are evolving towards ever increasing functionality and miniaturisation through the heterogeneous integration of separate components. The ideal integration requires precision placement of multiple types of devices on a substrate to allow their inter-connection. We propose to solve this integration challenge through an exciting new technique called micro-Transfer-Printing (TP) where the essential materials or devices, with thicknesses of a few microns, are separated from their native substrates and are transferred in parallel to the new platform according to the desired positioning while achieving micron-scale placement accuracy. Sequential application of the process enables different components of different functionality to be manipulated in a highly flexible and programmable way making best use of the materials. The TOP HIT project will aggressively develop and validate the TP technology by integrating electronics and photonics components for the magnetic and communication industries. These serve as examples for the broad capability of the technology which is compatible with low-cost manufacturing. We will develop ‘On Head Microelectronics’ for data storage smart systems through the embedded integration of custom electronic circuits directly into the magnetic read-head. We will demonstrate TP as a scalable method for the integration of compound semiconductor based elements (lasers, detectors) with silicon photonics platforms demonstrating both a compact receiver circuit and a transceiver. The partners in the TOP HIT consortium include international companies with extensive manufacturing capabilities, an SME, and two research institutes. The output of this project will help establish TP as a mainstream technology for heterogeneous integration, enabling manufacturing to be carried out in Europe through sales of equipment and through foundry services.

New more efficient smart products will emerge from the research carried out here.

Deliverables

List of deliverables.
Plan for access to technology	Documents, reports	2019-07-23 10:47:36
Newsletter	Documents, reports	2019-07-23 10:47:36

Take a look to the deliverables list in detail: detailed list of TOP HIT deliverables.

Publications

List of publications.
year	authors and title	journal	last update
2017	J. Oâ€™Callaghan, R. Loi, E. E. Mura, B. Roycroft, A. J. Trindade, K. Thomas, A. Gocalinska, E. Pelucchi, J. Zhang, G. Roelkens, C. A. Bower, B. Corbett Comparison of InGaAs and InAlAs sacrificial layers for release of InP-based devices published pages: 4408, ISSN: 2159-3930, DOI: 10.1364/ome.7.004408	Optical Materials Express 7/12	2019-07-23
2016	SÃ¶ren Dhoore, Sarah Uvin, Dries Van Thourhout, Geert Morthier, and Gunther Roelkens Novel adiabatic tapered couplers for active IIIâ€“V/SOI devices fabricated through transfer printing published pages: 12976-12990, ISSN: 1094-4087, DOI: 10.1364/OE.24.012976	Optics Express 24 (12)	2019-07-23
2018	G. Muliuk, K. Van Gasse, M. Shahin, J. Verbist, A.J. Trindade, B. Corbett, D. Van Thourhout, G. Roelkens \"4x25Gbit/s Silicon Photonics Tunable Receiver using Transfer Printed III-V Photodiodes\"\",\" published pages: , ISSN: , DOI:	IEEE Photonics Conference, Reston, VA, USA	2019-07-23
2017	Jing Zhang, Andreas De Groote, Amin Abbasi, Ruggero Loi, James Oâ€™Callaghan, Brian Corbett, AntÃ³nio JosÃ© Trindade, Christopher A. Bower, Gunther Roelkens Silicon photonics fiber-to-the-home transceiver array based on transfer-printing-based integration of III-V photodetectors published pages: 14290, ISSN: 1094-4087, DOI: 10.1364/OE.25.014290	Optics Express 25/13	2019-07-23
2018	Nan Ye, Grigorij Muliuk, Jing Zhang, Amin Abbasi, Antonio Jose Trindade, Chris Bower, Dries Van Thourhout, Gunther Roelkens Transfer Print Integration of Waveguide-Coupled Germanium Photodiodes Onto Passive Silicon Photonic ICs published pages: 1249-1254, ISSN: 0733-8724, DOI: 10.1109/JLT.2017.2777509	Journal of Lightwave Technology 36/5	2019-07-23
2016	Ruggero Loi, James O\'Callaghan, Brendan Roycroft, Cedric Robert, Alin Fecioru, Antonio Jose Trindade, Agnieszka Gocalinska, Emanuele Pelucchi, Christopher A. Bower, Brian Corbett Transfer Printing of AlGaInAs/InP Etched Facet Lasers to Si Substrates published pages: 1-10, ISSN: 1943-0655, DOI: 10.1109/JPHOT.2016.2627883	IEEE Photonics Journal 8/6	2019-07-23
2017	Jing Zhang, Yanlu Li, SÃ¶ren Dhoore, Geert Morthier, Gunther Roelkens Unidirectional, widely-tunable and narrow-linewidth heterogeneously integrated III-V-on-silicon laser published pages: 7092, ISSN: 1094-4087, DOI: 10.1364/OE.25.007092	Optics Express 25/6	2019-07-23
2017	Brian Corbett, Ruggero Loi, Weidong Zhou, Dong Liu, Zhenqiang Ma Transfer print techniques for heterogeneous integration of photonic components published pages: 1-17, ISSN: 0079-6727, DOI: 10.1016/j.pquantelec.2017.01.001	Progress in Quantum Electronics 52	2019-07-23
2018	Jing Zhang, Bahawal Haq, James Oâ€™Callaghan, Angieska Gocalinska, Emanuele Pelucchi, AntÃ³nio JosÃ© Trindade, Brian Corbett, Geert Morthier, Gunther Roelkens Transfer-printing-based integration of a III-V-on-silicon distributed feedback laser published pages: 8821, ISSN: 1094-4087, DOI: 10.1364/OE.26.008821	Optics Express 26/7	2019-07-23
2018	Nan Ye, Grigorij Muliuk, Antonio Jose Trindade, Chris Bower, Jing Zhang, Sarah Uvin, Dries Van Thourhout, Gunther Roelkens High-alignment-accuracy transfer printing of passive silicon waveguide structures published pages: 2023, ISSN: 1094-4087, DOI: 10.1364/oe.26.002023	Optics Express 26/2	2019-07-23
2018	Ruggero Loi, James O\'Callaghan, Brendan Roycroft, Zhiheng Quan, Kevin Thomas, Agnieszka Gocalinska, Emanuele Pelucchi, Antonio Jose Trindade, Chris Anthony Bower, Brian Corbett Thermal Analysis of InP Lasers Transfer-printed to Silicon Photonics Substrates published pages: 1-1, ISSN: 0733-8724, DOI: 10.1109/JLT.2018.2881179	Journal of Lightwave Technology	2019-07-23
2017	G. Muliuk, N. Ye, J. Zhang, A. Abbasi, D. Van Thourhout, G. Roelkens Transfer Print Integration of 40Gbps Germanium Photodiodes onto Silicon Photonic ICs published pages: , ISSN: , DOI:	European Conference on Optical Communication, Sweden, p.PDP.C.4 (2017).	2019-07-23
2016	Muliuk, Grigorij, et al. \"\"\"Transfer printing of silicon-on-insulator devices on silicon nitride waveguide circuits: design of coupling structures and process development.\"\"\" published pages: , ISSN: , DOI:	Proceedings Symposium IEEE Photonics Society Benelux. 2016.	2019-07-23
2017	Leili Abdollahi Shiramin, Alexandre Bazin, Steven Verstuyft, Sylvia Lycke, Peter Vandenabeele, Gunther Roelkens, Dries Van Thourhout Transfer Printing of Micron-Size Graphene for Photonic Integrated Circuits and Devices published pages: P435-P439, ISSN: 2162-8769, DOI: 10.1149/2.0241707jss	ECS Journal of Solid State Science and Technology 6/7	2019-07-23

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