Explore the words cloud of the TOP HIT project. It provides you a very rough idea of what is the project "TOP HIT" about.
The following table provides information about the project.
UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
|Coordinator Country||Ireland [IE]|
|Total cost||5˙252˙637 €|
|EC max contribution||5˙252˙637 € (100%)|
1. H2020-EU.18.104.22.168. (A new generation of components and systems: Engineering of advanced embedded and energy and resource efficient components and systems)
|Duration (year-month-day)||from 2015-02-02 to 2018-08-01|
Take a look of project's partnership.
|1||UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK||IE (Cork)||coordinator||908˙224.00|
|2||SEAGATE TECHNOLOGY IRELAND||UK (LONDONDERRY)||participant||1˙146˙250.00|
|3||INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM||BE (LEUVEN)||participant||862˙200.00|
|4||X-FAB MEMS FOUNDRY GmbH||DE (ERFURT)||participant||661˙945.00|
|5||HUAWEI TECHNOLOGIES RESEARCH & DEVELOPMENT BELGIUM||BE (GENT)||participant||631˙250.00|
|6||X-CELEPRINT LIMITED||IE (DUBLIN)||participant||552˙500.00|
|7||THE CENTRE FOR INTEGRATED PHOTONICS LIMITED||UK (IPSWICH, SUFFOLK)||participant||490˙268.00|
Smart systems technologies are evolving towards ever increasing functionality and miniaturisation through the heterogeneous integration of separate components. The ideal integration requires precision placement of multiple types of devices on a substrate to allow their inter-connection. We propose to solve this integration challenge through an exciting new technique called micro-Transfer-Printing (TP) where the essential materials or devices, with thicknesses of a few microns, are separated from their native substrates and are transferred in parallel to the new platform according to the desired positioning while achieving micron-scale placement accuracy. Sequential application of the process enables different components of different functionality to be manipulated in a highly flexible and programmable way making best use of the materials. The TOP HIT project will aggressively develop and validate the TP technology by integrating electronics and photonics components for the magnetic and communication industries. These serve as examples for the broad capability of the technology which is compatible with low-cost manufacturing. We will develop ‘On Head Microelectronics’ for data storage smart systems through the embedded integration of custom electronic circuits directly into the magnetic read-head. We will demonstrate TP as a scalable method for the integration of compound semiconductor based elements (lasers, detectors) with silicon photonics platforms demonstrating both a compact receiver circuit and a transceiver. The partners in the TOP HIT consortium include international companies with extensive manufacturing capabilities, an SME, and two research institutes. The output of this project will help establish TP as a mainstream technology for heterogeneous integration, enabling manufacturing to be carried out in Europe through sales of equipment and through foundry services.
New more efficient smart products will emerge from the research carried out here.
|Plan for access to technology||Documents, reports||2019-07-23 10:47:36|
|Newsletter||Documents, reports||2019-07-23 10:47:36|
Take a look to the deliverables list in detail: detailed list of TOP HIT deliverables.
|year||authors and title||journal||last update|
J. Oâ€™Callaghan, R. Loi, E. E. Mura, B. Roycroft, A. J. Trindade, K. Thomas, A. Gocalinska, E. Pelucchi, J. Zhang, G. Roelkens, C. A. Bower, B. Corbett
Comparison of InGaAs and InAlAs sacrificial layers for release of InP-based devices
published pages: 4408, ISSN: 2159-3930, DOI: 10.1364/ome.7.004408
|Optical Materials Express 7/12||2019-07-23|
SÃ¶ren Dhoore, Sarah Uvin, Dries Van Thourhout, Geert Morthier, and Gunther Roelkens
Novel adiabatic tapered couplers for active IIIâ€“V/SOI devices fabricated through transfer printing
published pages: 12976-12990, ISSN: 1094-4087, DOI: 10.1364/OE.24.012976
|Optics Express 24 (12)||2019-07-23|
G. Muliuk, K. Van Gasse, M. Shahin, J. Verbist, A.J. Trindade, B. Corbett, D. Van Thourhout, G. Roelkens
\"4x25Gbit/s Silicon Photonics Tunable Receiver using Transfer Printed III-V Photodiodes\"\",\"
published pages: , ISSN: , DOI:
|IEEE Photonics Conference, Reston, VA, USA||2019-07-23|
Jing Zhang, Andreas De Groote, Amin Abbasi, Ruggero Loi, James Oâ€™Callaghan, Brian Corbett, AntÃ³nio JosÃ© Trindade, Christopher A. Bower, Gunther Roelkens
Silicon photonics fiber-to-the-home transceiver array based on transfer-printing-based integration of III-V photodetectors
published pages: 14290, ISSN: 1094-4087, DOI: 10.1364/OE.25.014290
|Optics Express 25/13||2019-07-23|
Nan Ye, Grigorij Muliuk, Jing Zhang, Amin Abbasi, Antonio Jose Trindade, Chris Bower, Dries Van Thourhout, Gunther Roelkens
Transfer Print Integration of Waveguide-Coupled Germanium Photodiodes Onto Passive Silicon Photonic ICs
published pages: 1249-1254, ISSN: 0733-8724, DOI: 10.1109/JLT.2017.2777509
|Journal of Lightwave Technology 36/5||2019-07-23|
Ruggero Loi, James O\'Callaghan, Brendan Roycroft, Cedric Robert, Alin Fecioru, Antonio Jose Trindade, Agnieszka Gocalinska, Emanuele Pelucchi, Christopher A. Bower, Brian Corbett
Transfer Printing of AlGaInAs/InP Etched Facet Lasers to Si Substrates
published pages: 1-10, ISSN: 1943-0655, DOI: 10.1109/JPHOT.2016.2627883
|IEEE Photonics Journal 8/6||2019-07-23|
Jing Zhang, Yanlu Li, SÃ¶ren Dhoore, Geert Morthier, Gunther Roelkens
Unidirectional, widely-tunable and narrow-linewidth heterogeneously integrated III-V-on-silicon laser
published pages: 7092, ISSN: 1094-4087, DOI: 10.1364/OE.25.007092
|Optics Express 25/6||2019-07-23|
Brian Corbett, Ruggero Loi, Weidong Zhou, Dong Liu, Zhenqiang Ma
Transfer print techniques for heterogeneous integration of photonic components
published pages: 1-17, ISSN: 0079-6727, DOI: 10.1016/j.pquantelec.2017.01.001
|Progress in Quantum Electronics 52||2019-07-23|
Jing Zhang, Bahawal Haq, James Oâ€™Callaghan, Angieska Gocalinska, Emanuele Pelucchi, AntÃ³nio JosÃ© Trindade, Brian Corbett, Geert Morthier, Gunther Roelkens
Transfer-printing-based integration of a III-V-on-silicon distributed feedback laser
published pages: 8821, ISSN: 1094-4087, DOI: 10.1364/OE.26.008821
|Optics Express 26/7||2019-07-23|
Nan Ye, Grigorij Muliuk, Antonio Jose Trindade, Chris Bower, Jing Zhang, Sarah Uvin, Dries Van Thourhout, Gunther Roelkens
High-alignment-accuracy transfer printing of passive silicon waveguide structures
published pages: 2023, ISSN: 1094-4087, DOI: 10.1364/oe.26.002023
|Optics Express 26/2||2019-07-23|
Ruggero Loi, James O\'Callaghan, Brendan Roycroft, Zhiheng Quan, Kevin Thomas, Agnieszka Gocalinska, Emanuele Pelucchi, Antonio Jose Trindade, Chris Anthony Bower, Brian Corbett
Thermal Analysis of InP Lasers Transfer-printed to Silicon Photonics Substrates
published pages: 1-1, ISSN: 0733-8724, DOI: 10.1109/JLT.2018.2881179
|Journal of Lightwave Technology||2019-07-23|
G. Muliuk, N. Ye, J. Zhang, A. Abbasi, D. Van Thourhout, G. Roelkens
Transfer Print Integration of 40Gbps Germanium Photodiodes onto Silicon Photonic ICs
published pages: , ISSN: , DOI:
|European Conference on Optical Communication, Sweden, p.PDP.C.4 (2017).||2019-07-23|
Muliuk, Grigorij, et al.
\"\"\"Transfer printing of silicon-on-insulator devices on silicon nitride waveguide circuits: design of coupling structures and process development.\"\"\"
published pages: , ISSN: , DOI:
|Proceedings Symposium IEEE Photonics Society Benelux. 2016.||2019-07-23|
Leili Abdollahi Shiramin, Alexandre Bazin, Steven Verstuyft, Sylvia Lycke, Peter Vandenabeele, Gunther Roelkens, Dries Van Thourhout
Transfer Printing of Micron-Size Graphene for Photonic Integrated Circuits and Devices
published pages: P435-P439, ISSN: 2162-8769, DOI: 10.1149/2.0241707jss
|ECS Journal of Solid State Science and Technology 6/7||2019-07-23|
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