Opendata, web and dolomites

3D-LEAP SIGNED

3 Dimensional Light sEnsing for Advanced Portable Devices

Total Cost €

0

EC-Contrib. €

0

Partnership

0

Views

0

 3D-LEAP project word cloud

Explore the words cloud of the 3D-LEAP project. It provides you a very rough idea of what is the project "3D-LEAP" about.

introduce    difficult    mega    solution    lenses    productions    sensing    competitive    leadership    wlc    position    hollywood    modest    module    shift    sensors    public    players    platforms    lack    market    consistent    cameron    laptop    owned    lower    addressable    substrate    hit    movie    electronics    highest    barriers    3d    advantage    modules    cameras    penetration    mini    phones    pixels    europe    dimensional    ipr    overcome    james    hardware    structure    accelerate    entry    small    images    semiconductor    mobile    household    hurdle    avatar    trying    containing    competitors    share    figure    software    rules    creation    innovative    imagination    device    content    changer    technologies    2d    tvs    tablets    camera    global    integrating    computers    algorithms    segments    wafer    filters    producing    profitability    quality    meets    optics    captured    micro    makers    smart    disruptive    adoption    single    privilege    mass    professional    acute    paradigm    reached    color    imaging    image    lens   

Project "3D-LEAP" data sheet

The following table provides information about the project.

Coordinator
PHOTONIC SENSORS AND ALGORITHMS SL 

Organization address
address: CALLE GUARDIA CIVIL 23 ESC 2 10 38
city: VALENCIA
postcode: 46020
website: n.a.

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Spain [ES]
 Project website http://www.photoniktech.com/
 Total cost 3˙468˙925 €
 EC max contribution 2˙428˙192 € (70%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
2. H2020-EU.2.3.1. (Mainstreaming SME support, especially through a dedicated instrument)
 Code Call H2020-SMEINST-2-2015
 Funding Scheme SME-2
 Starting year 2015
 Duration (year-month-day) from 2015-07-01   to  2018-03-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    PHOTONIC SENSORS AND ALGORITHMS SL ES (VALENCIA) coordinator 2˙428˙192.00

Map

 Project objective

This proposal aims to develop 3 Dimensional Mini-cameras (producing 3D-Images) for mobile phones, tablets and laptop computers; more specifically embedded camera modules providing 2D and 3D-Images, integrating sensing electronics and optics in a single lens Wafer Level Camera (WLC).

This market creating innovative device is aiming towards disruptive market-share and global leadership in 3D-imaging camera modules, to accelerate our growth, profitability and Europe´s competitive position in smart cameras for 3D-imaging. We introduce a paradigm changer by applying new sets of rules in one of the highest growth areas addressable in consumer technologies and, we will set entry barriers that are difficult to overcome for current and new market players; we will hit the market while established competitors will still be trying to figure out our algorithms, our IPR and our hardware/software solution.

Our most disruptive competitive advantage is based on our algorithms. These exploit a novel hardware structure described in detail in the proposal. In short, we build micro-lenses on top of a semiconductor substrate containing image sensors or pixels with several color filters. 3D has captured the public imagination through Hollywood mega productions (like James Cameron´s Avatar). It has reached modest market penetration in different segments including movie productions, household 3D-TVs and cameras with two lenses. The hurdle to mass market adoption of the technology is the lack of consistent quality 3D content. The paradigm shift that our market creating innovative 3D camera module enables is that it meets the need for much higher quality content production at a lower cost, and will enable the creation of high-quality consumer-owned 3D-content on mobile platforms. Today, 3D content creation is the privilege of a small number of professional movie makers.

Are you the coordinator (or a participant) of this project? Plaese send me more information about the "3D-LEAP" project.

For instance: the website url (it has not provided by EU-opendata yet), the logo, a more detailed description of the project (in plain text as a rtf file or a word file), some pictures (as picture files, not embedded into any word file), twitter account, linkedin page, etc.

Send me an  email (fabio@fabiodisconzi.com) and I put them in your project's page as son as possible.

Thanks. And then put a link of this page into your project's website.

The information about "3D-LEAP" are provided by the European Opendata Portal: CORDIS opendata.

More projects from the same programme (H2020-EU.2.1.1.;H2020-EU.2.3.1.)

Assist (2015)

Telocate ASSIST – Development and marketing of an acoustic solution for localization and navigation of people in buildings using the smartphone

Read More  

Meshporto_smeIns1_2 (2018)

PsstMenu allows customers to place orders directly from home or restaurant tables using only a smartphone.

Read More  

WiNerve (2017)

Wireless Surgical Nerve Monitoring System

Read More