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3D-LEAP SIGNED

3 Dimensional Light sEnsing for Advanced Portable Devices

Total Cost €

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EC-Contrib. €

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Partnership

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 3D-LEAP project word cloud

Explore the words cloud of the 3D-LEAP project. It provides you a very rough idea of what is the project "3D-LEAP" about.

technologies    hardware    hit    sensing    advantage    imaging    containing    creation    rules    2d    difficult    mass    hurdle    semiconductor    integrating    computers    adoption    laptop    global    james    wafer    camera    movie    privilege    players    tablets    avatar    producing    competitors    hollywood    meets    makers    addressable    phones    entry    segments    micro    introduce    3d    trying    highest    sensors    cameras    small    pixels    paradigm    figure    mega    wlc    content    acute    mobile    shift    position    software    lower    tvs    dimensional    lenses    profitability    cameron    substrate    imagination    modules    mini    competitive    electronics    europe    barriers    ipr    lens    device    lack    leadership    household    penetration    images    module    color    platforms    disruptive    market    reached    optics    smart    share    single    public    modest    solution    structure    image    overcome    algorithms    owned    filters    innovative    professional    consistent    accelerate    captured    productions    changer    quality   

Project "3D-LEAP" data sheet

The following table provides information about the project.

Coordinator
PHOTONIC SENSORS AND ALGORITHMS SL 

Organization address
address: CALLE GUARDIA CIVIL 23 ESC 2 10 38
city: VALENCIA
postcode: 46020
website: n.a.

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Spain [ES]
 Project website http://www.photoniktech.com/
 Total cost 3˙468˙925 €
 EC max contribution 2˙428˙192 € (70%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
2. H2020-EU.2.3.1. (Mainstreaming SME support, especially through a dedicated instrument)
 Code Call H2020-SMEINST-2-2015
 Funding Scheme SME-2
 Starting year 2015
 Duration (year-month-day) from 2015-07-01   to  2018-03-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    PHOTONIC SENSORS AND ALGORITHMS SL ES (VALENCIA) coordinator 2˙428˙192.00

Map

 Project objective

This proposal aims to develop 3 Dimensional Mini-cameras (producing 3D-Images) for mobile phones, tablets and laptop computers; more specifically embedded camera modules providing 2D and 3D-Images, integrating sensing electronics and optics in a single lens Wafer Level Camera (WLC).

This market creating innovative device is aiming towards disruptive market-share and global leadership in 3D-imaging camera modules, to accelerate our growth, profitability and Europe´s competitive position in smart cameras for 3D-imaging. We introduce a paradigm changer by applying new sets of rules in one of the highest growth areas addressable in consumer technologies and, we will set entry barriers that are difficult to overcome for current and new market players; we will hit the market while established competitors will still be trying to figure out our algorithms, our IPR and our hardware/software solution.

Our most disruptive competitive advantage is based on our algorithms. These exploit a novel hardware structure described in detail in the proposal. In short, we build micro-lenses on top of a semiconductor substrate containing image sensors or pixels with several color filters. 3D has captured the public imagination through Hollywood mega productions (like James Cameron´s Avatar). It has reached modest market penetration in different segments including movie productions, household 3D-TVs and cameras with two lenses. The hurdle to mass market adoption of the technology is the lack of consistent quality 3D content. The paradigm shift that our market creating innovative 3D camera module enables is that it meets the need for much higher quality content production at a lower cost, and will enable the creation of high-quality consumer-owned 3D-content on mobile platforms. Today, 3D content creation is the privilege of a small number of professional movie makers.

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The information about "3D-LEAP" are provided by the European Opendata Portal: CORDIS opendata.

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