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PIXAPP SIGNED

Photonic Integrated Circuits Assembly and Packaging Pilot Line

Total Cost €

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EC-Contrib. €

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Partnership

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Project "PIXAPP" data sheet

The following table provides information about the project.

Coordinator
UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK 

Organization address
address: WESTERN ROAD
city: Cork
postcode: T12 YN60
website: www.ucc.ie

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Ireland [IE]
 Project website https://www.pixapp.eu/
 Total cost 15˙800˙921 €
 EC max contribution 13˙407˙812 € (85%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2016-1
 Funding Scheme IA
 Starting year 2017
 Duration (year-month-day) from 2017-01-01   to  2020-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK IE (Cork) coordinator 2˙750˙112.00
2    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) participant 1˙576˙090.00
3    CORDON ELECTRONICS ITALIA SRL IT (CORNATE D'ADDA) participant 931˙875.00
4    ARGOTECH AS CZ (NACHOD) participant 879˙943.00
5    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) participant 848˙892.00
6    FICONTEC SERVICE GMBH DE (ACHIM) participant 776˙343.00
7    Teknologian tutkimuskeskus VTT Oy FI (Espoo) participant 651˙151.00
8    LIONIX INTERNATIONAL BV NL (ENSCHEDE) participant 645˙750.00
9    COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES FR (PARIS 15) participant 629˙206.00
10    KARLSRUHER INSTITUT FUER TECHNOLOGIE DE (KARLSRUHE) participant 572˙250.00
11    TECHNISCHE UNIVERSITEIT EINDHOVEN NL (EINDHOVEN) participant 526˙690.00
12    PHOENIX BV NL (ENSCHEDE) participant 507˙798.00
13    TECHNOBIS IPPS BV NL (ALKMAAR) participant 500˙985.00
14    EUROPEAN PHOTONICS INDUSTRY CONSORTIUM FR (PARIS 16) participant 488˙250.00
15    MICROFLUIDIC CHIPSHOP GMBH DE (JENA) participant 401˙625.00
16    III-V LAB FR (PALAISEAU CEDEX) participant 327˙536.00
17    EBLANA PHOTONICS LIMITED IE (Dublin) participant 280˙437.00
18    Randox Laboratories Ltd UK (Crumlin) participant 93˙187.00
19    OPTOSCRIBE LIMITED UK (LIVINGSTON) participant 19˙687.00
20    Linkra S.R.L. IT (Cornate d'Adda) participant 0.00
21    LIONIX BV NL (ENSCHEDE) participant 0.00
22    PHIX BV NL (ENSCHEDE) participant 0.00
23    SUSS MICROOPTICS SA CH (HAUTERIVE) participant 0.00
24    VANGUARD AUTOMATION GMBH DE (KARLSRUHE) participant 0.00
25    XIO PHOTONICS BV NL (ENSCHEDE) participant 0.00

Map

 Project objective

PIXAPP will establish the world’s first open access Photonic Integrated Circuit (PIC) assembly & packaging Pilot Line. It combines a highly-interdisciplinary team of Europe’s leading industrial & research organisations. PIXAPP provides Europe’s SMEs with a unique one-stop-shop, enabling them to exploit the breakthrough advantages of PIC technologies. PIXAPP bridges the ‘valley of death’, providing SMEs with an easy access route to take R&D results from lab to market, giving them a competitive advantage over global competition. Target markets include communications, healthcare & security, which are of great socio-economic importance to Europe. PIXAPP’s manufacturing capabilities can support over 120 users per year, across all stages of manufacturing, from prototyping to medium scale manufacture. PIXAPP bridges missing gaps in the value chain, from assembly & packaging, through to equipment optimisation, test and application demonstration. To achieve these ambitious objectives, PIXAPP will; 1) Combine a group of Europe’s leading industrial & research organisations in an advanced PIC assembly & packaging Pilot Line facility.2) Develop an innovative Pilot Line operational model that coordinates activities between consortium partners & supports easy user access through a single entry point. 3) Establish packaging standards that provide cost-efficient assembly & packaging solutions, enabling transfer to full-scale industrial manufacture. 4) Create the highly-skilled workforce required to manage & operate these industrial manufacturing facilities.5) Develop a business plan to ensure Pilot Line sustainability & a route to industrial manufacturing. PIXAPP will deliver significant impacts to a wide stakeholder group, highlighting how industrial & research sectors can collaborate to address emerging socio-economic challenges.

 Publications

year authors and title journal last update
List of publications.
2019 Aleksandar Nesic, Matthias Blaicher, Tobias Hoose, Andreas Hofmann, Matthias Lauermann, Yasar Kutuvantavida, Martin Nöllenburg, Sebastian Randel, Wolfgang Freude, Christian Koos
Photonic-integrated circuits with non-planar topologies realized by 3D-printed waveguide overpasses
published pages: 17402, ISSN: 1094-4087, DOI: 10.1364/oe.27.017402
Optics Express 27/12 2020-03-05

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The information about "PIXAPP" are provided by the European Opendata Portal: CORDIS opendata.

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