Explore the words cloud of the PIXAPP project. It provides you a very rough idea of what is the project "PIXAPP" about.
The following table provides information about the project.
Coordinator |
UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK
Organization address contact info |
Coordinator Country | Ireland [IE] |
Project website | https://www.pixapp.eu/ |
Total cost | 15˙800˙921 € |
EC max contribution | 13˙407˙812 € (85%) |
Programme |
1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)) |
Code Call | H2020-ICT-2016-1 |
Funding Scheme | IA |
Starting year | 2017 |
Duration (year-month-day) | from 2017-01-01 to 2020-12-31 |
Take a look of project's partnership.
PIXAPP will establish the world’s first open access Photonic Integrated Circuit (PIC) assembly & packaging Pilot Line. It combines a highly-interdisciplinary team of Europe’s leading industrial & research organisations. PIXAPP provides Europe’s SMEs with a unique one-stop-shop, enabling them to exploit the breakthrough advantages of PIC technologies. PIXAPP bridges the ‘valley of death’, providing SMEs with an easy access route to take R&D results from lab to market, giving them a competitive advantage over global competition. Target markets include communications, healthcare & security, which are of great socio-economic importance to Europe. PIXAPP’s manufacturing capabilities can support over 120 users per year, across all stages of manufacturing, from prototyping to medium scale manufacture. PIXAPP bridges missing gaps in the value chain, from assembly & packaging, through to equipment optimisation, test and application demonstration. To achieve these ambitious objectives, PIXAPP will; 1) Combine a group of Europe’s leading industrial & research organisations in an advanced PIC assembly & packaging Pilot Line facility.2) Develop an innovative Pilot Line operational model that coordinates activities between consortium partners & supports easy user access through a single entry point. 3) Establish packaging standards that provide cost-efficient assembly & packaging solutions, enabling transfer to full-scale industrial manufacture. 4) Create the highly-skilled workforce required to manage & operate these industrial manufacturing facilities.5) Develop a business plan to ensure Pilot Line sustainability & a route to industrial manufacturing. PIXAPP will deliver significant impacts to a wide stakeholder group, highlighting how industrial & research sectors can collaborate to address emerging socio-economic challenges.
year | authors and title | journal | last update |
---|---|---|---|
2019 |
Aleksandar Nesic, Matthias Blaicher, Tobias Hoose, Andreas Hofmann, Matthias Lauermann, Yasar Kutuvantavida, Martin Nöllenburg, Sebastian Randel, Wolfgang Freude, Christian Koos Photonic-integrated circuits with non-planar topologies realized by 3D-printed waveguide overpasses published pages: 17402, ISSN: 1094-4087, DOI: 10.1364/oe.27.017402 |
Optics Express 27/12 | 2020-03-05 |
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The information about "PIXAPP" are provided by the European Opendata Portal: CORDIS opendata.