Opendata, web and dolomites

DIMENSION SIGNED

Directly Modulated Lasers on Silicon

Total Cost €

0

EC-Contrib. €

0

Partnership

0

Views

0

Project "DIMENSION" data sheet

The following table provides information about the project.

Coordinator
TECHNISCHE UNIVERSITAET DRESDEN 

Organization address
address: HELMHOLTZSTRASSE 10
city: DRESDEN
postcode: 1069
website: http://www.tu-dresden.de/

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Germany [DE]
 Project website http://dimension-h2020.eu
 Total cost 3˙422˙128 €
 EC max contribution 2˙621˙758 € (77%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2015
 Funding Scheme RIA
 Starting year 2016
 Duration (year-month-day) from 2016-02-01   to  2020-09-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    TECHNISCHE UNIVERSITAET DRESDEN DE (DRESDEN) coordinator 705˙500.00
2    IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK DE (FRANKFURT ODER) participant 800˙633.00
3    ADVA OPTICAL NETWORKING SE DE (MEININGEN) participant 522˙500.00
4    ALTER TECHNOLOGY TUV NORD UK LIMITED UK (LIVINGSTON) participant 322˙500.00
5    RESEARCH AND EDUCATION LABORATORY IN INFORMATION TECHNOLOGIES EL (Athens) participant 270˙625.00
6    IBM RESEARCH GMBH CH (RUESCHLIKON) participant 0.00

Map

 Project objective

DIMENSION establishes a truly integrated electro-optical platform, extending the silicon (Bi)CMOS and silicon photonics platform with III-V photonic functionality. The III-V integration concept is fully CMOS compatible and offers fundamental advantages compared to state-of-the art integration approaches. After bonding and growing ultra-thin III-V structures onto the silicon front-end-of-line, the active optical functions are embedded into the back-end of line stack. This offers great opportunities for new innovative devices and functions at the chip-level but also for the assembly of such silicon devices. As processing takes place on silicon wafers, this project has the unique opportunity to bring the cost of integrated devices, with CMOS, photonic and III-V functionality, down to the cost of silicon volume manufacturing. Such a platform has the potential to allow Europe to take a leading position in the field of high functionality integrated photonics. Moreover, the project demonstrators adhere to standards such as IEEE802.3, 25G optical components and low-power electronics, thus opening a viable route towards ultra-low-cost high-performance optical transceivers for a new era of data centres and cloud systems. DIMENSION will realise three demonstrators: • A short-reach transmitter for intra-datacenter operation addressing the 400 GbE-LR8 (IEEE 802.3bs) standard making use of an array of directly modulated lasers, pulse-amplitude-modulation (PAM4) techniques and 8 wavelength channels in the telecom O-band. • A medium-reach transmitter for inter-datacenter applications beyond the 400 GbE-LR8 (IEEE 802.3bs) standard by providing a tuneable coherent transmitter for inter-datacenter and metro applications for link lengths in excess of 10km using a modulator integrated on the same chip. • A novel laser directly grown on silicon photonics, operated at 25Gb/s in the telecom O-band demonstrating the significant cost-saving potential of the technologies pursued in DIMENSION.

 Deliverables

List of deliverables.
Report on basic component characterization Documents, reports 2020-01-21 10:09:13
Data Management Plan Documents, reports 2020-01-21 10:09:12
Report on system specifications Documents, reports 2020-01-21 10:09:13
Second report on dissemination, exploitation and standardisation activities Documents, reports 2020-01-21 10:09:13
First report on electrical design Documents, reports 2020-01-21 10:09:13
Second periodic report – governing the first fabrication iteration Documents, reports 2020-01-21 10:09:13
Report on techno-economical evaluation Documents, reports 2020-01-21 10:09:13
Report on component-level and single-channel characterization Documents, reports 2020-01-21 10:09:13
Project presentation document, website public, intranet active Websites, patent fillings, videos etc. 2020-01-21 10:09:12
First report on dissemination, exploitation and standardisation activities Documents, reports 2020-01-21 10:09:12
Interim progress report Documents, reports 2020-01-21 10:09:12
First periodic report – governing the design phase Documents, reports 2020-01-21 10:09:12
Report on component specifications Documents, reports 2020-01-21 10:09:13

Take a look to the deliverables list in detail:  detailed list of DIMENSION deliverables.

 Publications

year authors and title journal last update
List of publications.
2018 P. Torres-Ferrera, M.A. García-Yáñez, R. Gutiérrez-Castrejón, I. Tomkos
Coherent optical WDM systems for 1.6 Tb/s Ethernet over 40 km of single-mode fiber
published pages: , ISSN: 1068-5200, DOI: 10.1016/j.yofte.2018.01.021
Optical Fiber Technology 2020-01-21
2017 Herwig Hahn, Marilyne Sousa, Lukas Czornomaz
Low-resistive, CMOS-compatible ohmic contact schemes to moderately doped n-InP
published pages: 235102, ISSN: 0022-3727, DOI: 10.1088/1361-6463/aa6f7a
Journal of Physics D: Applied Physics 50/23 2020-01-21
2016 Despoina Petousi, Pedro Rito, Stefan Lischke, Dieter Knoll, Iria Garcia-Lopez, Marcel Kroh, Rainer Barth, Christian Mai, Ahmet-Cagri Ulusoy, Anna Peczek, Georg Winzer, Karsten Voigt, Dietmar Kissinger, Klaus Petermann, Lars Zimmermann
Monolithically Integrated High-Extinction-Ratio MZM With a Segmented Driver in Photonic BiCMOS
published pages: 2866-2869, ISSN: 1041-1135, DOI: 10.1109/LPT.2016.2624700
IEEE Photonics Technology Letters 28/24 2020-01-21
2018 N. Neumann, Z. Al-Husseini and D. Plettemeier
Nonlinearity, noise and bandwidth influence for PAM4 modulation format
published pages: , ISSN: , DOI:
2020-01-21
2018 Christos A. Thraskias, Eythimios N. Lallas, Niels Neumann, Laurent Schares, Bert J. Offrein, Ronny Henker, Dirk Plettemeier, Frank Ellinger, Juerg Leuthold, Ioannis Tomkos
Survey of Photonic and Plasmonic Interconnect Technologies for Intra-Datacenter and High-Performance Computing Communications
published pages: 2758-2783, ISSN: 1553-877X, DOI: 10.1109/comst.2018.2839672
IEEE Communications Surveys & Tutorials 20/4 2020-01-21
2018 Marc Seifried, Gustavo Villares, Yannick Baumgartner, Herwig Hahn, Mattia Halter, Folkert Horst, Daniele Caimi, Charles Caer, Marilyne Sousa, Roger Franz Dangel, Lukas Czornomaz, Bert Jan Offrein
Monolithically Integrated CMOS-Compatible III–V on Silicon Lasers
published pages: 1-9, ISSN: 1077-260X, DOI: 10.1109/jstqe.2018.2832654
IEEE Journal of Selected Topics in Quantum Electronics 24/6 2020-01-21
2017 Benjamin Wohlfeil, Danish Rafique, and Michael Eiselt
Photonic Integrated Circuits for Data Center Interconnects
published pages: , ISSN: , DOI:
European Conference on Integrated optics (ECIO) 2020-01-21
2018 Roger Dangel, Antonio La Porta, Daniel Jubin, Folkert Horst, Norbert Meier, Marc Seifried, Bert J. Offrein
Polymer Waveguides Enabling Scalable Low-Loss Adiabatic Optical Coupling for Silicon Photonics
published pages: 1-11, ISSN: 1077-260X, DOI: 10.1109/jstqe.2018.2812603
IEEE Journal of Selected Topics in Quantum Electronics 24/4 2020-01-21
2018 Giuglea, G. Belfiore, M. Khafaji, R. Henker, D. Petousi, G. Winzer, L. Zimmermann and F. Ellinger
Comparison of Segmented and Traveling-Wave Electro-Optical Transmitters Based on Silicon Photonics Mach-Zehnder Modulators
published pages: , ISSN: , DOI:
International Conference on Photonics in Switching and Computing 2020-01-21
2018 Benjamin Wohlfeil, Gilda Raoof Mehrpoor, Annika Dochhan, Danish Rafique, Michael Eiselt and Jörg-Peter Elbers
Photonic integrated circuits for data center interconnects
published pages: , ISSN: , DOI:
International Conference on Photonics in Switching and Computing 2020-01-21

Are you the coordinator (or a participant) of this project? Plaese send me more information about the "DIMENSION" project.

For instance: the website url (it has not provided by EU-opendata yet), the logo, a more detailed description of the project (in plain text as a rtf file or a word file), some pictures (as picture files, not embedded into any word file), twitter account, linkedin page, etc.

Send me an  email (fabio@fabiodisconzi.com) and I put them in your project's page as son as possible.

Thanks. And then put a link of this page into your project's website.

The information about "DIMENSION" are provided by the European Opendata Portal: CORDIS opendata.

More projects from the same programme (H2020-EU.2.1.1.)

OpertusMundi (2020)

A Single Digital Market for Industrial Geospatial Data Assets

Read More  

EuConNeCts4 (2019)

European Conferences on Networks and Communications (EuCNC)

Read More  

IMPACT EdTech (2019)

Incubating High-IMPACT New Generation EdTech Disruptors for Inclusive & Personalised Learning

Read More