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TAKEMI5 SIGNED

Technology Advances and Key Enablers for Module Integration for 5 nm

Total Cost €

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EC-Contrib. €

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Partnership

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Project "TAKEMI5" data sheet

The following table provides information about the project.

Coordinator
ASML NETHERLANDS B.V. 

Organization address
address: DE RUN 6501
city: VELDHOVEN
postcode: 5504DR
website: www.asml.com

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Netherlands [NL]
 Total cost 132˙778˙302 €
 EC max contribution 28˙339˙999 € (21%)
 Programme 1. H2020-EU.2.1.1.7. (ECSEL)
 Code Call H2020-ECSEL-2016-2-IA-two-stage
 Funding Scheme ECSEL-IA
 Starting year 2017
 Duration (year-month-day) from 2017-04-01   to  2019-11-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    ASML NETHERLANDS B.V. NL (VELDHOVEN) coordinator 7˙013˙260.00
2    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) participant 6˙326˙198.00
3    CARL ZEISS SMT GMBH DE (OBERKOCHEN) participant 5˙596˙579.00
4    APPLIED MATERIALS ISRAEL LTD IL (REHOVOT) participant 1˙922˙500.00
5    NOVA MEASURING INSTRUMENTS LTD IL (REHOVOT) participant 1˙338˙555.00
6    FEI ELECTRON OPTICS BV NL (EINDHOVEN) participant 965˙492.00
7    INSTITUT FUER MIKROELEKTRONIK STUTTGART DE (STUTTGART) participant 957˙888.00
8    KLA-TENCOR CORPORATION (ISRAEL) IL (MIGDAL HAEMEK) participant 901˙217.00
9    NANOMOTION LTD IL (Yokneam) participant 444˙143.00
10    NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO NL (DEN HAAG) participant 412˙533.00
11    COVENTOR SARL FR (VILLEBON SUR YVETTE) participant 407˙728.00
12    ICT Integrated Circuit Testing GmbH DE (Heimstetten) participant 366˙500.00
13    ION BEAM SERVICES FR (ROUSSET) participant 296˙931.00
14    APPLIED MATERIALS BELGIUM BE (LEUVEN) participant 232˙256.00
15    PFEIFFER VACUUM FR (ANNECY) participant 224˙956.00
16    SEMILAB FELVEZETO FIZIKAI LABORATORIUM RESZVENYTARSASAG HU (BUDAPEST) participant 213˙401.00
17    ACTIVE TECHNOLOGIES SRL IT (FERRARA) participant 202˙888.00
18    EMC ISRAEL DEVELOPMENT CENTER LTD IL (HERZLIYA) participant 199˙575.00
19    RECIF TECHNOLOGIES FR (Blagnac) participant 95˙400.00
20    CRYTUR SPOL.S.R.O. CZ (TURNOV) participant 70˙000.00
21    FYZIKALNI USTAV AV CR V.V.I CZ (PRAHA 8) participant 48˙562.00
22    LAM RESEARCH BELGIUM BE (LEUVEN) participant 38˙023.00
23    ASYS AUTOMATIC SYSTEMS GMBH & CO KG DE (SCHORNDORF) participant 26˙433.00
24    ICOS VISION SYSTEMS NV BE (HEVERLEE) participant 25˙972.00
25    AIS AUTOMATION DRESDEN GmbH DE (DRESDEN) participant 13˙003.00
26    BRUKER JV ISRAEL LTD IL (MIGDAL HAEMEK) participant 0.00

Map

 Project objective

In line with industry needs, Moore’s law, scaling in ITRS 2013/2015, and ECSEL JU MASP 2016, the main objective of the TAKEMI5 project is to discover, develop and demonstrate lithographic, metrology, process and integration technologies enabling module integration for the 5 nm node. This is planned with available EUV/NA0.33 scanners that are optimized for mix and match with existing DUV/NA1.35 scanners, and with system design and development of a new hyper NA EUV lithography tool to enable more single exposure patterning at 5 nm to create complex integrated circuits. Process steps for modules in Front-end, Middle and Back-end of line are discovered and developed using the most advanced tool capabilities and they are evaluated morphologically and electrically using a relaxed test vehicle. During the development, specific challenges in metrology are assessed and metrology tools are upgraded or newly developed. The results are demonstrated in the imec pilot line with qualified metrology tools at the 5 nm node. The TAKEMI5 project relates to the ECSEL work program topic Process technologies – More Moore. It addresses and targets, as set out in the MASP, at a (disruptive) new Semiconductor Process, Equipment and Materials solutions for advanced CMOS processes that enable the module integration of electronic devices for the 5nm node in high-volume manufacturing and fast prototyping. The project touches the core of the continuation of Moore’s law which has celebrated its 50th anniversary. The cost aware development process supports the involved companies, and places them in an enhanced position for their worldwide competition. Through their worldwide affiliations, the impact of the TAKEMI5 project will be felt outside Europe in America and Asia Pacific semiconductor centers and is expected to benefit the European economy a lot by supporting its semiconductor equipment and metrology sectors with innovations, exports and employment.

 Publications

year authors and title journal last update
List of publications.
2019 Lars Wischmeier
Pushing limits of optical lithography: Status and future perspectives of EUVL optics
published pages: , ISSN: , DOI:
\"17th Workshop \"\"Beams and More\"\", Suttgart, 2019\" 2019 2020-03-17
2019 Aliasghar Keyvani, Mehmet S. Tamer, Maarten H. v. Es, Marco v.d.Lans
Frequency Modulation Sub-surface Atomic Force Microscopy (poster presentation)
published pages: , ISSN: , DOI:
Semicon Innovation Day 2019 21-05-2019 2020-03-17
2019 Laurent Fillinger, Mehmet S. Tamer, Maarten H. v. Es, Marco v.d.Lans
Advanced Processing for Quantitative Sub-surface Data Extraction (poster presentation)
published pages: , ISSN: , DOI:
Semicon Innovation Day 2019 21-05-2019 2020-03-17
2019 Maarten E. v. Reijzen, Mehmet S. Tamer, Maarten H. v. Es, Martijn v. Riel, Tom Duivenvoorde Aliasghar Keyvani, Hamed Sadeghian, Marco v.d. Lans
Sub-surface Imaging with Photo Thermal Actuation(poster presentation)
published pages: , ISSN: , DOI:
Semicon Innovation Day 2019 21-05-2019 2020-03-17
2019 Maarten H. van Es, Laurent Fillinger, Mehmet S. Tamer, Marco van der Lans
High Resolution SubSurface Probe Microscopy for node5 applications
published pages: , ISSN: , DOI:
Semicon Innovation Day 2019 21-05-2019 2020-03-17
2019 Kateřina Rubešová, Jan Havlíček, Vít Jakeš, Ladislav Nádherný, Jakub Cajzl, Dalibor Pánek, Tomáš Parkman, Alena Beitlerova, Romana Kučerková, František Hájek, Martin Nikl
Heavily Ce 3+ -doped Y 3 Al 5 O 12 thin films deposited by a polymer sol–gel method for fast scintillation detectors
published pages: 5115-5123, ISSN: 1466-8033, DOI: 10.1039/c9ce00842j
CrystEngComm 21/34 2020-03-17
2017 Maarten. H. van Es, Martijn van Riel, Tom Duivenvoorde, Hamed Sadeghian
Electrostatically actuated probes for Scanning Sub-surface Ultrasonic Resonance Frequency Microscopy
published pages: , ISSN: , DOI:
3rd ERP 3D Nanomanufacturing Dissemination Event Proceedings 06-11-2017 2020-03-17
2017 Maarten. H. van Es, Hamed Sadeghian
Frequency Modulation Subsurface Ultrasonic Force Microscopy
published pages: , ISSN: , DOI:
3rd ERP 3D Nanomanufacturing Dissemination Event Proceedings 06-11-2017 2020-03-17

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The information about "TAKEMI5" are provided by the European Opendata Portal: CORDIS opendata.

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