Opendata, web and dolomites

MUNDFAB SIGNED

Modeling Unconventional Nanoscaled Device FABrication

Total Cost €

0

EC-Contrib. €

0

Partnership

0

Views

0

 MUNDFAB project word cloud

Explore the words cloud of the MUNDFAB project. It provides you a very rough idea of what is the project "MUNDFAB" about.

regrowth    workflow    big    topography    power    simulate    3d    tools    indispensable    electron    continuum    generations    structures    data    looped    architectures    the3d    industrial    nanosecond    performed    continued    computer    mobility    models    silicon    stages    faceting    unconventional    insufficient    explicitly    layers    predicted    moore    solid    predict    nor    dopants    time    nanosized    energy    materials    aided    sequential    virtual    temperature    scaling    kmc    complete    whenever    lose    deposition    continuing    sentaurus    overcome    nano    complemented    annealing    nanoscaled    device    decade    accordingly    story    because    activation    nanoelectronics    lkmc    calibrated    investigations    things    germanium    defect    first    experimental    integration    roadmap    fabrication    electrical    simulation    world    tcad    performance    model    ppac    nereid    situation    epitaxial    formerly    internet    predictive    commercial    paradigm    predictivity    technologies    sufficient    alloys    requests    toolchain    laser    area   

Project "MUNDFAB" data sheet

The following table provides information about the project.

Coordinator
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. 

Organization address
address: HANSASTRASSE 27C
city: MUNCHEN
postcode: 80686
website: www.fraunhofer.de

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Germany [DE]
 Total cost 3˙787˙988 €
 EC max contribution 3˙787˙988 € (100%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2019-2
 Funding Scheme RIA
 Starting year 2020
 Duration (year-month-day) from 2020-01-01   to  2022-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) coordinator 746˙047.00
2    COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES FR (PARIS 15) participant 786˙618.00
3    CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRS FR (PARIS) participant 660˙065.00
4    TECHNISCHE UNIVERSITAET WIEN AT (WIEN) participant 600˙823.00
5    CONSIGLIO NAZIONALE DELLE RICERCHE IT (ROMA) participant 537˙395.00
6    SIEC BADAWCZA LUKASIEWICZ - INSTYTUT TECHNOLOGII MATERIALOW ELEKTRONICZNYCH PL (WARSZAWA) participant 302˙500.00
7    STMICROELECTRONICS CROLLES 2 SAS FR (CROLLES) participant 154˙538.00

Map

 Project objective

Because of power, energy, and cost reasons, a further development of big data and mobility applications as well as the Internet of Things will require continued Power-Performance-Area-and-Cost (PPAC, formerly More Moore) scaling. This is predicted to lead within less than a decade to a paradigm change towards the 3D sequential integration of nanosized structures. While technology-computer aided design (TCAD) is indispensable now particularly for the early stages of industrial research and development, we face the situation that classical continuum tools lose their predictivity when going towards the nano world and towards the very low temperature processes required for 3D sequential integration. They are then neither able to predict the reduced electrical activation of dopants, nor topography effects like faceting, nor defect formation and growth. Accordingly, the NEREID NanoElectronics Roadmap for Europe explicitly requests to “…develop new tools taking into account all the new materials, technologies and device architectures…” To overcome the insufficient state of models and tools for a predictive simulation of low-temperature processing of high-mobility layers like silicon-germanium alloys, dedicated experimental investigations will be performed for solid-phase epitaxial regrowth, epitaxial deposition, and nanosecond laser annealing. Model development will be based whenever possible on the KMC and LKMC tools of Sentaurus Process, complemented by model development with own tools only when the functionality of commercial products is not sufficient. Own tools will be looped into the Sentaurus TCAD workflow so that in the end we will for the first time present a complete calibrated toolchain able to simulate the virtual fabrication of the3D sequential integration of nanoscaled devices. This will allow continuing further on the success story of the use of TCAD for the early development of the next generations of unconventional nanoscaled electron devices.

Are you the coordinator (or a participant) of this project? Plaese send me more information about the "MUNDFAB" project.

For instance: the website url (it has not provided by EU-opendata yet), the logo, a more detailed description of the project (in plain text as a rtf file or a word file), some pictures (as picture files, not embedded into any word file), twitter account, linkedin page, etc.

Send me an  email (fabio@fabiodisconzi.com) and I put them in your project's page as son as possible.

Thanks. And then put a link of this page into your project's website.

The information about "MUNDFAB" are provided by the European Opendata Portal: CORDIS opendata.

More projects from the same programme (H2020-EU.2.1.1.)

ADEPTNESS (2020)

Design-Operation Continuum Methods for Testing and Deployment under Unforeseen Conditions for Cyber-Physical Systems of Systems

Read More  

DIH-HERO (2019)

Digital Innovation Hubs in Healthcare Robotics

Read More  

I.AM. (2020)

Impact Aware Manipulation by Dexterous Robot Control and Learning in Dynamic Semi-Structured Logistic Environments

Read More