Opendata, web and dolomites

MUNDFAB SIGNED

Modeling Unconventional Nanoscaled Device FABrication

Total Cost €

0

EC-Contrib. €

0

Partnership

0

Views

0

 MUNDFAB project word cloud

Explore the words cloud of the MUNDFAB project. It provides you a very rough idea of what is the project "MUNDFAB" about.

continued    because    energy    faceting    tcad    continuum    things    moore    experimental    layers    structures    aided    continuing    deposition    sentaurus    simulation    power    decade    solid    workflow    defect    nano    overcome    epitaxial    the3d    mobility    nor    indispensable    complemented    nereid    electron    sufficient    materials    nanoscaled    nanosized    architectures    insufficient    model    ppac    lkmc    whenever    electrical    predictive    calibrated    computer    big    models    predicted    integration    industrial    performance    predictivity    lose    device    topography    unconventional    area    technologies    complete    explicitly    activation    first    internet    virtual    simulate    alloys    temperature    sequential    investigations    generations    3d    dopants    predict    accordingly    stages    regrowth    situation    tools    story    commercial    toolchain    nanosecond    silicon    nanoelectronics    looped    kmc    germanium    performed    formerly    data    requests    world    scaling    fabrication    annealing    laser    roadmap    paradigm    time   

Project "MUNDFAB" data sheet

The following table provides information about the project.

Coordinator
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. 

Organization address
address: HANSASTRASSE 27C
city: MUNCHEN
postcode: 80686
website: www.fraunhofer.de

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Germany [DE]
 Total cost 3˙787˙988 €
 EC max contribution 3˙787˙988 € (100%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2019-2
 Funding Scheme RIA
 Starting year 2020
 Duration (year-month-day) from 2020-01-01   to  2022-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) coordinator 746˙047.00
2    COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES FR (PARIS 15) participant 786˙618.00
3    CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRS FR (PARIS) participant 660˙065.00
4    TECHNISCHE UNIVERSITAET WIEN AT (WIEN) participant 600˙823.00
5    CONSIGLIO NAZIONALE DELLE RICERCHE IT (ROMA) participant 537˙395.00
6    SIEC BADAWCZA LUKASIEWICZ - INSTYTUT TECHNOLOGII MATERIALOW ELEKTRONICZNYCH PL (WARSZAWA) participant 302˙500.00
7    STMICROELECTRONICS CROLLES 2 SAS FR (CROLLES) participant 154˙538.00

Map

 Project objective

Because of power, energy, and cost reasons, a further development of big data and mobility applications as well as the Internet of Things will require continued Power-Performance-Area-and-Cost (PPAC, formerly More Moore) scaling. This is predicted to lead within less than a decade to a paradigm change towards the 3D sequential integration of nanosized structures. While technology-computer aided design (TCAD) is indispensable now particularly for the early stages of industrial research and development, we face the situation that classical continuum tools lose their predictivity when going towards the nano world and towards the very low temperature processes required for 3D sequential integration. They are then neither able to predict the reduced electrical activation of dopants, nor topography effects like faceting, nor defect formation and growth. Accordingly, the NEREID NanoElectronics Roadmap for Europe explicitly requests to “…develop new tools taking into account all the new materials, technologies and device architectures…” To overcome the insufficient state of models and tools for a predictive simulation of low-temperature processing of high-mobility layers like silicon-germanium alloys, dedicated experimental investigations will be performed for solid-phase epitaxial regrowth, epitaxial deposition, and nanosecond laser annealing. Model development will be based whenever possible on the KMC and LKMC tools of Sentaurus Process, complemented by model development with own tools only when the functionality of commercial products is not sufficient. Own tools will be looped into the Sentaurus TCAD workflow so that in the end we will for the first time present a complete calibrated toolchain able to simulate the virtual fabrication of the3D sequential integration of nanoscaled devices. This will allow continuing further on the success story of the use of TCAD for the early development of the next generations of unconventional nanoscaled electron devices.

Are you the coordinator (or a participant) of this project? Plaese send me more information about the "MUNDFAB" project.

For instance: the website url (it has not provided by EU-opendata yet), the logo, a more detailed description of the project (in plain text as a rtf file or a word file), some pictures (as picture files, not embedded into any word file), twitter account, linkedin page, etc.

Send me an  email (fabio@fabiodisconzi.com) and I put them in your project's page as son as possible.

Thanks. And then put a link of this page into your project's website.

The information about "MUNDFAB" are provided by the European Opendata Portal: CORDIS opendata.

More projects from the same programme (H2020-EU.2.1.1.)

DEL4ALL (2020)

Digital Enhanced Learning for ALL

Read More  

NGIAtlantic.eu (2020)

A Collaborative platform for EU-US NGI experiments

Read More  

SOMA (2018)

Social Observatory for Disinformation and Social Media Analysis

Read More