Opendata, web and dolomites

MUNDFAB SIGNED

Modeling Unconventional Nanoscaled Device FABrication

Total Cost €

0

EC-Contrib. €

0

Partnership

0

Views

0

 MUNDFAB project word cloud

Explore the words cloud of the MUNDFAB project. It provides you a very rough idea of what is the project "MUNDFAB" about.

virtual    calibrated    world    model    paradigm    kmc    integration    nanosecond    epitaxial    performance    lkmc    continuing    predictivity    explicitly    defect    decade    power    insufficient    germanium    indispensable    faceting    area    solid    complemented    lose    commercial    moore    whenever    looped    sentaurus    the3d    materials    deposition    nereid    topography    regrowth    computer    nanoscaled    performed    investigations    3d    nanosized    tcad    annealing    electrical    scaling    continuum    technologies    nanoelectronics    structures    sequential    first    internet    data    roadmap    device    overcome    time    simulation    mobility    simulate    accordingly    formerly    requests    laser    layers    models    workflow    activation    story    experimental    predictive    aided    toolchain    because    silicon    complete    ppac    tools    industrial    architectures    dopants    predict    temperature    situation    fabrication    energy    unconventional    alloys    nano    big    sufficient    electron    generations    predicted    stages    continued    nor    things   

Project "MUNDFAB" data sheet

The following table provides information about the project.

Coordinator
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. 

Organization address
address: HANSASTRASSE 27C
city: MUNCHEN
postcode: 80686
website: www.fraunhofer.de

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Germany [DE]
 Total cost 3˙787˙988 €
 EC max contribution 3˙787˙988 € (100%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2019-2
 Funding Scheme RIA
 Starting year 2020
 Duration (year-month-day) from 2020-01-01   to  2022-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) coordinator 746˙047.00
2    COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES FR (PARIS 15) participant 786˙618.00
3    CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRS FR (PARIS) participant 660˙065.00
4    TECHNISCHE UNIVERSITAET WIEN AT (WIEN) participant 600˙823.00
5    CONSIGLIO NAZIONALE DELLE RICERCHE IT (ROMA) participant 537˙395.00
6    SIEC BADAWCZA LUKASIEWICZ - INSTYTUT TECHNOLOGII MATERIALOW ELEKTRONICZNYCH PL (WARSZAWA) participant 302˙500.00
7    STMICROELECTRONICS CROLLES 2 SAS FR (CROLLES) participant 154˙538.00

Map

 Project objective

Because of power, energy, and cost reasons, a further development of big data and mobility applications as well as the Internet of Things will require continued Power-Performance-Area-and-Cost (PPAC, formerly More Moore) scaling. This is predicted to lead within less than a decade to a paradigm change towards the 3D sequential integration of nanosized structures. While technology-computer aided design (TCAD) is indispensable now particularly for the early stages of industrial research and development, we face the situation that classical continuum tools lose their predictivity when going towards the nano world and towards the very low temperature processes required for 3D sequential integration. They are then neither able to predict the reduced electrical activation of dopants, nor topography effects like faceting, nor defect formation and growth. Accordingly, the NEREID NanoElectronics Roadmap for Europe explicitly requests to “…develop new tools taking into account all the new materials, technologies and device architectures…” To overcome the insufficient state of models and tools for a predictive simulation of low-temperature processing of high-mobility layers like silicon-germanium alloys, dedicated experimental investigations will be performed for solid-phase epitaxial regrowth, epitaxial deposition, and nanosecond laser annealing. Model development will be based whenever possible on the KMC and LKMC tools of Sentaurus Process, complemented by model development with own tools only when the functionality of commercial products is not sufficient. Own tools will be looped into the Sentaurus TCAD workflow so that in the end we will for the first time present a complete calibrated toolchain able to simulate the virtual fabrication of the3D sequential integration of nanoscaled devices. This will allow continuing further on the success story of the use of TCAD for the early development of the next generations of unconventional nanoscaled electron devices.

Are you the coordinator (or a participant) of this project? Plaese send me more information about the "MUNDFAB" project.

For instance: the website url (it has not provided by EU-opendata yet), the logo, a more detailed description of the project (in plain text as a rtf file or a word file), some pictures (as picture files, not embedded into any word file), twitter account, linkedin page, etc.

Send me an  email (fabio@fabiodisconzi.com) and I put them in your project's page as son as possible.

Thanks. And then put a link of this page into your project's website.

The information about "MUNDFAB" are provided by the European Opendata Portal: CORDIS opendata.

More projects from the same programme (H2020-EU.2.1.1.)

5G-COMPLETE (2019)

A unified network, Computational and stOrage resource Management framework targeting end-to-end Performance optimization for secure 5G muLti-tEchnology and multi-Tenancy Environments

Read More  

Smart2Go (2019)

Smart and Flexible Energy Supply Platform for Wearable Electronics

Read More  

NEoteRIC (2020)

NEuromorphic Reconfigurable Integrated photonic Circuits as artificial image processor

Read More