Coordinatore | UNIVERSITAT POLITECNICA DE VALENCIA
Organization address
address: CAMINO DE VERA SN EDIFICIO 3A contact info |
Nazionalità Coordinatore | Spain [ES] |
Totale costo | 1˙951˙103 € |
EC contributo | 1˙495˙364 € |
Programma | FP7-SPACE
Specific Programme "Cooperation": Space |
Code Call | FP7-SPACE-2012-1 |
Funding Scheme | CP-FP |
Anno di inizio | 2012 |
Periodo (anno-mese-giorno) | 2012-11-01 - 2015-10-31 |
# | ||||
---|---|---|---|---|
1 |
UNIVERSITAT POLITECNICA DE VALENCIA
Organization address
address: CAMINO DE VERA SN EDIFICIO 3A contact info |
ES (VALENCIA) | coordinator | 212˙038.50 |
2 |
DAS PHOTONICS SL
Organization address
address: "CALLE ISLAS CANARIAS, 6 - 8" contact info |
ES (VALENCIA) | participant | 416˙264.73 |
3 |
IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK
Organization address
address: IM TECHNOLOGIEPARK 25 contact info |
DE (FRANKFURT (ODER)) | participant | 309˙999.50 |
4 |
MODULIGHT OY
Organization address
address: HERMIANKATU 22 contact info |
FI (TAMPERE) | participant | 198˙032.00 |
5 |
POLITECNICO DI BARI
Organization address
address: VIA E ORABONA 4 contact info |
IT (BARI) | participant | 140˙800.00 |
6 |
CONSTELEX TECHNOLOGY ENABLERS LTD
Organization address
address: Ikoniou 17 contact info |
EL (Athens) | participant | 133˙435.27 |
7 |
AIRBUS DEFENCE AND SPACE SAS
Organization address
address: 51-61 Route de Verneuil contact info |
FR (LES MUREAUX) | participant | 84˙794.00 |
Esplora la "nuvola delle parole (Word Cloud) per avere un'idea di massima del progetto.
'Space system vendors seek for solutions to deliver small size and cost-effective sensor systems to “de-congest” satellite payloads, drastically reduce the equipment cost and open the possibility for new generation of micro-payload systems. MERMIG aims to provide this technology replacing current expensive, bulky, heavy and power-consuming fiber optic gyroscopes (FOGs). To address these key challenges, MERMIG invests in the right mix of silicon photonic CMOS-compatible component fabrication and nano-imprint lithography laser fabrication. Both technologies are being adopted by the terrestrial telecom market and MERMIG will develop them for bringing their unique advantages into space sensor systems. MERMIG will squeeze the bulky FOG into a couple of cm2, integrating a racetrack cavity, pin junctions and a phase decoder into compact sub-micron waveguides. The MERMIG “smart” packaging technique will allow power-efficient optical pumping and hermetic packaging of the gyro-photonic chip. MERMIG will develop the first 1550nm high-power laser with a fiber-coupled power of 150mW using an integrated laser MOPA, fabricated with advanced nano-imprint lithography (NIL). The 150mW delivered will enable a modular architecture, with pump sharing among 3 integrated silicon lasing cavities, for 3-axis sensing. The single-step NIL process enables fast wafer scale patterning and ensures low-cost and high-volume laser production. Finally, MERMIG will bring together photonics and electronics on a fully-functional opto-electronic gyroscope system prototype characterized according to ASTRIUM testplan procedures. MERMIG will deliver to ASTRIUM a new generation gyroscope that will weigh <1kg, consume <5W electrical power in a few cm3 footprint. The angle random walk range that will be feasible within MERMIG is 0.1 – 0.01 deg/sqrt(hr) suitable for telecommunications and scientific satellites. The technology full potential can allow for future opto-electronic integration of photonic “gyroscopes-on-a-chip”.'
As every gramme and centimetre matters when launching satellites into orbit, an EU-funded project is working on minimising the size and weight of their attitude control systems.
The EU-funded project 'Modular CMOS photonic integrated micro-gyroscope' (http://www.mermig-space.eu/ (MERMIG)) aims to make way for extra satellite payload by replacing the bulky and heavy fibre optic gyroscope. The six academic and industrial MERMIG partners are building a micro-gyroscope that will weigh less than 1 kg and be smaller than a couple centimetres cubed to take its place.
For this new generation of micro-gyroscopes capable of withstanding the harsh environment of satellites placed in geostationary orbit, they are exploiting the latest advances in silicon nanophotonics. Specifically, complementary metal-oxide semiconductor (CMOS) technology used to integrate electronic and optical elements on the same chip is being combined with nano-imprint lithography.
MERMIG partners are adapting both technologies for space sensor systems. During the first reporting period, they squeezed the heavy and large fibre-based opticalcavity to a couple millimetres squared. All the key functionalities of an optical cavity-based sensor were integrated into a silicon photonic chip of 4.84 mm x 1 mm. In the next reporting period, the chip will be further developed to demonstrate Raman lasing.
Furthermore, MERMIG project members built a 1 550 nm laser that can deliver optical power up to 150 mW with a driving current of about 1 A. Fabricated by means of nano-imprint lithography, it is complemented by an optical fibre-based amplifier improving the output power. In a master oscillator power amplifier configuration, the laser together with the amplifier is suitable for three-axis sensing and diverse space applications.
The high-frequency noise added to the signal is so low that the new micro-gyroscope will be suitable for telecommunications as well as scientific satellites. On the other hand, it will also meet the stringent mass constraints of rovers used in planetary exploration missions. The photonic gyroscope circuits can be fabricated in high volumes at low cost with exciting prospects for the European space industry.
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