Opendata, web and dolomites

WAYTOGO FAST SIGNED

Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologies

Total Cost €

0

EC-Contrib. €

0

Partnership

0

Views

0

Project "WAYTOGO FAST" data sheet

The following table provides information about the project.

Coordinator
STMICROELECTRONICS CROLLES 2 SAS 

Organization address
address: RUE JEAN MONNET 850
city: CROLLES
postcode: 38920
website: www.st.com

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country France [FR]
 Total cost 99˙399˙264 €
 EC max contribution 25˙796˙579 € (26%)
 Programme 1. H2020-EU.2.1.1.7. (ECSEL)
 Code Call ECSEL-2014-2
 Funding Scheme /ECSEL-IA
 Starting year 2015
 Duration (year-month-day) from 2015-05-01   to  2017-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    STMICROELECTRONICS CROLLES 2 SAS FR (CROLLES) coordinator 1˙515˙366.00
2    COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES FR (PARIS 15) participant 13˙831˙513.00
3    SOITEC SA FR (BERNIN) participant 3˙777˙540.00
4    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) participant 1˙289˙579.00
5    STMICROELECTRONICS S.A. FR (MONTROUGE) participant 708˙501.00
6    BRUKER AXS GMBH DE (KARLSRUHE) participant 694˙160.00
7    CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRS FR (PARIS) participant 594˙996.00
8    EV GROUP E. THALLNER GMBH AT (ST FLORIAN AM INN) participant 534˙464.00
9    SOCIONEXT EUROPE GMBH DE (LANGEN) participant 284˙754.00
10    FEI ELECTRON OPTICS BV NL (EINDHOVEN) participant 259˙898.00
11    NOVA MEASURING INSTRUMENTS LTD IL (REHOVOT) participant 247˙812.00
12    GLOBALFOUNDRIES Dresden Module One LLC & Co. KG DE (Dresden) participant 244˙805.00
13    INSTITUT POLYTECHNIQUE DE GRENOBLE FR (GRENOBLE CEDEX 1) participant 200˙000.00
14    SILTRONIC AG DE (MUNCHEN) participant 168˙564.00
15    HSEB DRESDEN GMBH DE (DRESDEN) participant 145˙131.00
16    INTEGRATED SYSTEMS DEVELOPMENT S.A. EL (Maroussi) participant 132˙234.00
17    SONY DEUTSCHLAND GMBH DE (BERLIN) participant 129˙200.00
18    PRODRIVE TECHNOLOGIES BV NL (SON) participant 113˙750.00
19    MUNEDA GMBH DE (UNTERHACHING) participant 113˙442.00
20    Gold Standard Simulations ltd UK (Glasgow) participant 105˙300.00
21    LAM RESEARCH SAS FR (MEYLAN) participant 99˙009.00
22    GLOBAL TCAD SOLUTIONS GMBH AT (WIEN) participant 98˙820.00
23    HQ-Dielectrics GmbH DE (Dornstadt) participant 98˙628.00
24    UNIVERSITE CATHOLIQUE DE LOUVAIN BE (LOUVAIN LA NEUVE) participant 84˙906.00
25    DAINIPPON SCREEN DEUTSCHLAND GMBH DE (DUSSELDORF) participant 75˙584.00
26    PICOSUN OY FI (ESPOO) participant 72˙970.00
27    ALCATEL-LUCENT DEUTSCHLAND AG DE (STUTTGART) participant 66˙375.00
28    APPLIED MATERIALS FRANCE FR (BERNIN) participant 60˙519.00
29    UNIVERSIDAD DE GRANADA ES (GRANADA) participant 48˙750.00
30    LAM RESEARCH AG AT (VILLACH) participant 0.00
31    STMICROELECTRONICS GRENOBLE 2 SAS FR (GRENOBLE) participant 0.00
32    TOKYO ELECTRON EUROPE LIMITED UK (CRAWLEY) participant 0.00

Mappa

 Project objective

The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilot line between 2 companies: - Soitec for the fabrication of advanced engineered substrates (UTBB: Ultra Thin Body and BOx (buried oxide)) without and with strained silicon top film. - STMicroelectronics for the development and industrialization of state of the art FDSOI technology platform at 14nm and beyond with an industry competitive Power-Performance-Area-Cost (PPAC) trade-off. The project represents the first phase of a 2 phase program aiming at establishing a 10nm FDSOI technology for 2018-19. A strong added value network is created across this project to enhance a competitive European value chain on a European breakthrough and prepare next big wave of electronic devices. The consortium gathers a large group of partners: academics/institutes, equipment and substrate providers, semiconductor companies, a foundry, EDA providers, IP providers, fabless design houses, and a system manufacturer. E&M will contribute to the objective of installing a pilot line capable of manufacturing both advanced SOI substrates and FDSOI CMOS integrated circuits at 14nm and beyond. Design houses and electronics system manufacturer will provide demonstrator and enabling IP, to spread the FDSOI technology and establish it as a standard in term of leading edge energy efficient CMOS technology for a wide range of applications battery operated (consumer , healthcare, Internet of things) or not. Close collaboration between the design activities and the technology definition will tailor the PPAC trade-off of the next generation of technology to the applications needs.

 Work performed, outcomes and results:  advancements report(s) 

Are you the coordinator (or a participant) of this project? Plaese send me more information about the "WAYTOGO FAST" project.

For instance: the website url (it has not provided by EU-opendata yet), the logo, a more detailed description of the project (in plain text as a rtf file or a word file), some pictures (as picture files, not embedded into any word file), twitter account, linkedin page, etc.

Send me an  email (fabio@fabiodisconzi.com) and I put them in your project's page as son as possible.

Thanks. And then put a link of this page into your project's website.

The information about "WAYTOGO FAST" are provided by the European Opendata Portal: CORDIS opendata.

More projects from the same programme (H2020-EU.2.1.1.7.)

WAKeMeUP (2018)

Wafers for Automotive and other Key applications using Memories, embedded in Ulsi Processors

Read More  

EuroPAT-MASIP (2017)

European Packaging, Assembly and Test Pilot for Manufacturing of Advanced System-in-Package

Read More  

TAPES3 (2018)

Technology Advances for Pilotline of Enhanced Semiconductors for 3nm

Read More