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ADMONT SIGNED

Advanced Distributed Pilot Line for More-than-Moore Technologies

Total Cost €

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EC-Contrib. €

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Partnership

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Project "ADMONT" data sheet

The following table provides information about the project.

Coordinator
X-FAB Dresden GmbH & Co. KG 

Organization address
address: GRENZSTRASSE 28
city: DRESDEN
postcode: 1109
website: n.a.

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Germany [DE]
 Project website http://www.admont-project.eu
 Total cost 38˙905˙159 €
 EC max contribution 11˙096˙414 € (29%)
 Programme 1. H2020-EU.2.1.1.7. (ECSEL)
 Code Call ECSEL-2014-2
 Funding Scheme ECSEL-IA
 Starting year 2015
 Duration (year-month-day) from 2015-05-01   to  2019-04-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    X-FAB Dresden GmbH & Co. KG DE (DRESDEN) coordinator 1˙952˙934.00
2    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) participant 5˙310˙500.00
3    HEIMANN SENSOR GMBH DE (DRESDEN) participant 831˙740.00
4    MENARINI SILICON BIOSYSTEMS SPA IT (CASTEL MAGGIORE BO) participant 784˙630.00
5    IMMS INSTITUT FUER MIKROELEKTRONIK- UND MECHATRONIK-SYSTEME GMBH DE (ILMENAU) participant 620˙382.00
6    SENSEAIR AB SE (DELSBO) participant 408˙633.00
7    SYSTEMA SYSTEMENTWICKLUNG DIPL INF.MANFRED AUSTEN GMBH DE (DRESDEN) participant 357˙274.00
8    AMS SENSORS GERMANY GMBH DE (JENA) participant 180˙557.00
9    FABMATICS GMBH DE (DRESDEN) participant 160˙140.00
10    EDC ELECTRONIC DESIGN CHEMNITZ GMBH DE (CHEMNITZ) participant 134˙443.00
11    OKMETIC OY FI (VANTAA) participant 100˙070.00
12    SMARTRAC TECHNOLOGY GMBH DE (LEINFELDEN ECHTERDINGEN) participant 90˙659.00
13    TECHNIKON FORSCHUNGS- UND PLANUNGSGESELLSCHAFT MBH AT (VILLACH) participant 90˙194.00
14    ONCOMPASS MEDICINE HUNGARY KORLATOLT FELELOSSEGU TARSASAG HU (BUDAPEST) participant 74˙255.00
15    ROTH & RAU - ORTNER GMBH DE (DRESDEN) participant 0.00

Map

 Project objective

The “Advanced Distributed Pilot Line for More-than-Moore Technologies” project (ADMONT) is focused on a powerful and versatile More-than-Moore (MtM) pilot line for Europe increasing the diversification of CMOS process technologies. The combination of existing expertise, technological capabilities and the manufacturing capacity of industrial and research partners creates a whole new ecosystem within Europe’s biggest silicon technology cluster “Silicon Saxony”. The distributed pilot line utilizes various MtM platform technologies for sensor and OLED processing in combination with baseline CMOS processes in a unique way and incorporates 2.5D as well as 3D integration of silicon systems into one single production flow. The technology modules, equipment and processes are not located in one single clean room, but are distributed between partners located in Dresden. This local concentration of micro- and nanotechnology facilities has various advantages for potential customer since it enables a short production cycle time and fast delivery. Such distributed MtM pilot line is unique in Europe as well as worldwide and will be implemented as “one-stop-shop” for partners and customer. It is supported by advanced design technologies to address the challenges of modelling and simulation of MtM relevant aspects like reliability, degradation effects, process variability, and IT solution aspects for MtM smart fabrication, fab automation and data processing to generate a smart infrastructure. The distributed pilot line is working as an open platform and is able to integrate future technologies for autonomous and smart system solutions. ADMONT is focused on four main key applications: smart energy, smart mobility, smart health, and smart production and essential capabilities like semiconductor process equipment and materials, design technology and smart system integration. The project consortium is organized and working along the value chain for ECS technologies in Europe.

 Deliverables

List of deliverables.
Update of Line capability report including Documents, reports 2019-02-26 09:58:59
Final business plan and exploitation report Websites, patent fillings, videos etc. 2019-02-26 09:58:57
Risk Assessment Plan Documents, reports 2019-05-30 11:35:15
Draft of Line capability report including key performance indicators Documents, reports 2019-05-30 11:35:15
System Specification and system related pilot line requirements Documents, reports 2019-05-30 11:35:15
Public IT component and architecture specification Documents, reports 2019-05-30 11:35:18
Internal and external IT communication Demonstrators, pilots, prototypes 2019-05-30 11:35:14
Initial report and updates on dissemination, exploitation and standardisation activities Documents, reports 2019-05-30 11:35:16
Intermediate business plan and exploitation report Documents, reports 2019-05-30 11:35:17
Data Management Plan (DMP) Documents, reports 2019-05-30 11:35:13
Business Process Model (BPM) and Specification Sheet Documents, reports 2019-05-30 11:35:14

Take a look to the deliverables list in detail:  detailed list of ADMONT deliverables.

 Publications

year authors and title journal last update
List of publications.
2019 Stegemann, Karl-Heinz
ADMONT KET Pilot Line: A success story
published pages: pp. 44 - 47, ISSN: 2632-4067, DOI: 10.5281/zenodo.2657031
The Project Repository Journal Volume 1 1 2019-08-05
2018 Medoro, Gianni; Maximilian, Sergio; Bevilacqua, Elena
A single cell technology for personalised medicine
published pages: pp. 21 - 23, ISSN: , DOI: 10.5281/zenodo.1313452
EU Researcher Summer 2018 1 2019-08-05
2019 Fabio A. Velarde Gonzalez, Kay-Uwe Giering, André Lange, Insaf Lahbib, Sonja Crocoll
Toward consistent circuit-level aging simulationsin different EDA environments
published pages: , ISSN: , DOI:
\"31. GI/GMM/ITG-Workshop \"\"Testmethoden und Zuverlässigkeit von Schaltungen und Systemen\"\" (TUZ 2019)\" 24th-26th February 2019 2019-08-05
2018 Velarde Gonzalez, F.A.; Lange, A.; Crocoll, S.; Jancke, R.
NBTI and HCI models for circuit level aging simulations in different EDA environments
published pages: , ISSN: , DOI: 10.5281/zenodo.2558154
ESREF 2018, 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis 2019-08-05
2016 M. Jahnel, M. Schober, K. Fehse, O.R. Hild
Structured organic photodetectors via orthogonal photolithography
published pages: , ISSN: , DOI: 10.5281/zenodo.1312785
Fraunhofer FEP Industry Partners Day in Dresden 2019-06-18
2016 Matthias Jahnel, Matthias Schober, Karsten Fehse, Olaf Hild, Uwe Vogel
Thin Film Organic Photodiodes on Complementary Metal-Oxide-Semiconductor (CMOS) Materials Structured via Orthogonal Photolithography for Sensor Applications
published pages: , ISSN: , DOI:
23rd International Display Workshops in conjunction with Asia Display 2016 7th-9th December 2016 2019-06-18
2015 Matthias Jahnel, Beatrice Beyer, Michael Thomschke, Karsten Fehse, Felix Krujatz, Karl Leo
Narrow Bandwidth Top-Emitting OLEDs Designed for Rhodamine 6G Excitation in Biological Sensing Applications
published pages: 982-994, ISSN: 2079-9292, DOI: 10.3390/electronics4040982
Electronics 4/4 2019-06-18

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