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3D-LEAP

3 Dimensional Light Sensor for Advanced Portable Devices

Total Cost €

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EC-Contrib. €

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Partnership

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 Outcomes and results

 3D-LEAP project word cloud

Explore the words cloud of the 3D-LEAP project. It provides you a very rough idea of what is the project "3D-LEAP" about.

companies    lens    choose    highest    europe    electronics    device    structure    model    handful    sell    tablets    first    imaging    volumes    customers    ipr    wafer    sensing    tablet    competitors    distributors    fsov    figure    foundries    accelerating    2d    correctness    trying    minimize    marketing    3d    acceptance    technologies    laptop    contacts    disruptive    obtaining    candidate    players    miniaturized    single    manufacturing    manufacturers    data    materials    solution    think    fsv    global    silicon    business    plans    entry    addressable    verify    light    paradigm    acute    image    performed    fabless    optical    competitive    algorithms    advantage    position    quotations    sectors    phones    feasibility    plan    exact    mobile    roadmap    bill    millions    wlc    introduce    computers    taiwanese    changer    optics    hardware    network    bom    units    layers    market    barriers    overcome    shares    price    sales    images    smart    camera    visit    cameras    sensors    extend    semiconductor    dimensional    vendor    modules    setting    parties    difficult    leadership    hit    integrating    risks   

Project "3D-LEAP" data sheet

The following table provides information about the project.

Coordinator		 PHOTONIC SENSORS AND ALGORITHMS SL 

Organization address
address: CALLE GUARDIA CIVIL 23 ESC 2 10 38
city: VALENCIA
postcode: 46020
website: n.a.

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.
 Coordinator Country Spain [ES]
 Total cost 71˙429 €
 EC max contribution 50˙000 € (70%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
2. H2020-EU.2.3.1. (Mainstreaming SME support, especially through a dedicated instrument)
 Code Call H2020-SMEINST-1-2014
 Funding Scheme SME-1
 Starting year 2014
 Duration (year-month-day) from 2014-10-01   to  2014-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    PHOTONIC SENSORS AND ALGORITHMS SL ES (VALENCIA) coordinator 50˙000.00

Map

 Project objective

This proposal aims to develop miniaturized 3 Dimensional (3D) cameras for mobile phones, tablets and laptop computers; more specifically embedded camera modules providing 2D and 3D-Images, integrating image-sensing electronics and light-field optics in a single lens Wafer Level Camera (WLC). This disruptive device is aiming towards significant market-shares and global leadership in 3D-imaging camera modules, accelerating our growth and Europe´s Competitive position in Smart Cameras for 3D-imaging. We introduce a paradigm changer in one of the highest growth areas addressable in consumer technologies, setting entry barriers difficult to overcome for current and new market players; we will hit the market while established competitors will still be trying to figure out our algorithms, our IPR and our hardware solution. Our most disruptive competitive advantage is based on our algorithms, exploiting a novel hardware structure. First contacts with Taiwanese distributors and manufacturers of laptop/network/tablet computers and mobile phones allow us to think that such a disruptive device can sell millions of units. This phase-1 study will minimize technical and market acceptance risks. We extend the well-known FSV-model to FSOV (Fabless Semiconductor and Optical Vendor). Manufacturing, both for the semiconductor image sensors and for the optical layers on top of it, will be performed by third parties (silicon foundries and optical foundries). One of the main tasks of this feasibility study is to choose the best manufacturing partners from the handful of candidate companies in both sectors (silicon and optics), as well as obtaining exact quotations for the costs of the BOM (Bill of Materials); we will also visit some potential customers to verify correctness of the data (sales volumes and price targets) and build a Business Plan that will include Product Roadmap, Project Plan and Marketing and Sales Plans.

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The information about "3D-LEAP" are provided by the European Opendata Portal: CORDIS opendata.

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