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3D-LEAP

3 Dimensional Light Sensor for Advanced Portable Devices

Total Cost €

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EC-Contrib. €

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Partnership

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 Outcomes and results

 3D-LEAP project word cloud

Explore the words cloud of the 3D-LEAP project. It provides you a very rough idea of what is the project "3D-LEAP" about.

customers    2d    introduce    feasibility    manufacturers    layers    foundries    network    handful    units    model    camera    competitors    distributors    3d    sell    fsv    parties    sensing    business    sectors    visit    optics    plan    difficult    europe    sales    optical    ipr    figure    global    hardware    solution    disruptive    fabless    imaging    mobile    computers    wlc    risks    technologies    tablet    bom    cameras    highest    device    modules    overcome    obtaining    position    taiwanese    sensors    phones    addressable    tablets    first    trying    silicon    miniaturized    laptop    hit    millions    accelerating    competitive    quotations    manufacturing    volumes    leadership    integrating    players    materials    exact    images    wafer    extend    shares    think    image    paradigm    correctness    acute    light    semiconductor    companies    candidate    contacts    changer    dimensional    fsov    single    electronics    entry    advantage    algorithms    vendor    smart    minimize    setting    verify    acceptance    choose    data    structure    bill    roadmap    marketing    lens    market    price    barriers    performed    plans   

Project "3D-LEAP" data sheet

The following table provides information about the project.

Coordinator		 PHOTONIC SENSORS AND ALGORITHMS SL 

Organization address
address: CALLE GUARDIA CIVIL 23 ESC 2 10 38
city: VALENCIA
postcode: 46020
website: n.a.

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.
 Coordinator Country Spain [ES]
 Total cost 71˙429 €
 EC max contribution 50˙000 € (70%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
2. H2020-EU.2.3.1. (Mainstreaming SME support, especially through a dedicated instrument)
 Code Call H2020-SMEINST-1-2014
 Funding Scheme SME-1
 Starting year 2014
 Duration (year-month-day) from 2014-10-01   to  2014-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    PHOTONIC SENSORS AND ALGORITHMS SL ES (VALENCIA) coordinator 50˙000.00

Map

 Project objective

This proposal aims to develop miniaturized 3 Dimensional (3D) cameras for mobile phones, tablets and laptop computers; more specifically embedded camera modules providing 2D and 3D-Images, integrating image-sensing electronics and light-field optics in a single lens Wafer Level Camera (WLC). This disruptive device is aiming towards significant market-shares and global leadership in 3D-imaging camera modules, accelerating our growth and Europe´s Competitive position in Smart Cameras for 3D-imaging. We introduce a paradigm changer in one of the highest growth areas addressable in consumer technologies, setting entry barriers difficult to overcome for current and new market players; we will hit the market while established competitors will still be trying to figure out our algorithms, our IPR and our hardware solution. Our most disruptive competitive advantage is based on our algorithms, exploiting a novel hardware structure. First contacts with Taiwanese distributors and manufacturers of laptop/network/tablet computers and mobile phones allow us to think that such a disruptive device can sell millions of units. This phase-1 study will minimize technical and market acceptance risks. We extend the well-known FSV-model to FSOV (Fabless Semiconductor and Optical Vendor). Manufacturing, both for the semiconductor image sensors and for the optical layers on top of it, will be performed by third parties (silicon foundries and optical foundries). One of the main tasks of this feasibility study is to choose the best manufacturing partners from the handful of candidate companies in both sectors (silicon and optics), as well as obtaining exact quotations for the costs of the BOM (Bill of Materials); we will also visit some potential customers to verify correctness of the data (sales volumes and price targets) and build a Business Plan that will include Product Roadmap, Project Plan and Marketing and Sales Plans.

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The information about "3D-LEAP" are provided by the European Opendata Portal: CORDIS opendata.

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