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3D-LEAP

3 Dimensional Light Sensor for Advanced Portable Devices

Total Cost €

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EC-Contrib. €

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Partnership

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 Outcomes and results

 3D-LEAP project word cloud

Explore the words cloud of the 3D-LEAP project. It provides you a very rough idea of what is the project "3D-LEAP" about.

manufacturers    entry    data    computers    materials    highest    optical    light    feasibility    optics    model    tablets    changer    roadmap    taiwanese    hit    network    extend    verify    sensing    exact    choose    obtaining    competitive    position    difficult    wlc    image    visit    acute    figure    introduce    manufacturing    solution    players    shares    europe    paradigm    quotations    foundries    market    fsv    lens    distributors    semiconductor    algorithms    contacts    mobile    bom    handful    fabless    integrating    leadership    millions    bill    single    modules    business    risks    first    acceptance    structure    wafer    imaging    price    ipr    sales    competitors    images    hardware    vendor    accelerating    miniaturized    technologies    electronics    device    cameras    layers    dimensional    companies    sensors    trying    think    performed    marketing    sectors    customers    minimize    camera    laptop    disruptive    fsov    global    candidate    plans    correctness    advantage    3d    volumes    units    barriers    silicon    overcome    2d    phones    sell    tablet    plan    addressable    setting    parties    smart   

Project "3D-LEAP" data sheet

The following table provides information about the project.

Coordinator		 PHOTONIC SENSORS AND ALGORITHMS SL 

Organization address
address: CALLE GUARDIA CIVIL 23 ESC 2 10 38
city: VALENCIA
postcode: 46020
website: n.a.

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.
 Coordinator Country Spain [ES]
 Total cost 71˙429 €
 EC max contribution 50˙000 € (70%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
2. H2020-EU.2.3.1. (Mainstreaming SME support, especially through a dedicated instrument)
 Code Call H2020-SMEINST-1-2014
 Funding Scheme SME-1
 Starting year 2014
 Duration (year-month-day) from 2014-10-01   to  2014-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    PHOTONIC SENSORS AND ALGORITHMS SL ES (VALENCIA) coordinator 50˙000.00

Map

 Project objective

This proposal aims to develop miniaturized 3 Dimensional (3D) cameras for mobile phones, tablets and laptop computers; more specifically embedded camera modules providing 2D and 3D-Images, integrating image-sensing electronics and light-field optics in a single lens Wafer Level Camera (WLC). This disruptive device is aiming towards significant market-shares and global leadership in 3D-imaging camera modules, accelerating our growth and Europe´s Competitive position in Smart Cameras for 3D-imaging. We introduce a paradigm changer in one of the highest growth areas addressable in consumer technologies, setting entry barriers difficult to overcome for current and new market players; we will hit the market while established competitors will still be trying to figure out our algorithms, our IPR and our hardware solution. Our most disruptive competitive advantage is based on our algorithms, exploiting a novel hardware structure. First contacts with Taiwanese distributors and manufacturers of laptop/network/tablet computers and mobile phones allow us to think that such a disruptive device can sell millions of units. This phase-1 study will minimize technical and market acceptance risks. We extend the well-known FSV-model to FSOV (Fabless Semiconductor and Optical Vendor). Manufacturing, both for the semiconductor image sensors and for the optical layers on top of it, will be performed by third parties (silicon foundries and optical foundries). One of the main tasks of this feasibility study is to choose the best manufacturing partners from the handful of candidate companies in both sectors (silicon and optics), as well as obtaining exact quotations for the costs of the BOM (Bill of Materials); we will also visit some potential customers to verify correctness of the data (sales volumes and price targets) and build a Business Plan that will include Product Roadmap, Project Plan and Marketing and Sales Plans.

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The information about "3D-LEAP" are provided by the European Opendata Portal: CORDIS opendata.

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