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3D-LEAP

3 Dimensional Light Sensor for Advanced Portable Devices

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EC-Contrib. €

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Partnership

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 Outcomes and results

 3D-LEAP project word cloud

Explore the words cloud of the 3D-LEAP project. It provides you a very rough idea of what is the project "3D-LEAP" about.

tablet    advantage    sell    roadmap    fsov    network    model    vendor    price    materials    trying    tablets    imaging    technologies    wafer    bill    companies    plan    obtaining    plans    3d    highest    units    sales    difficult    shares    competitors    optical    accelerating    layers    computers    changer    hit    exact    bom    verify    integrating    distributors    first    electronics    customers    light    dimensional    handful    volumes    ipr    manufacturers    phones    miniaturized    barriers    addressable    images    algorithms    single    overcome    global    camera    business    data    risks    fsv    smart    taiwanese    foundries    fabless    position    semiconductor    acute    modules    image    minimize    entry    performed    visit    optics    silicon    choose    disruptive    competitive    hardware    wlc    cameras    acceptance    feasibility    europe    candidate    introduce    device    figure    parties    setting    solution    sectors    lens    manufacturing    extend    leadership    sensors    correctness    laptop    quotations    2d    structure    sensing    marketing    mobile    paradigm    contacts    think    players    market    millions   

Project "3D-LEAP" data sheet

The following table provides information about the project.

Coordinator		 PHOTONIC SENSORS AND ALGORITHMS SL 

Organization address
address: CALLE GUARDIA CIVIL 23 ESC 2 10 38
city: VALENCIA
postcode: 46020
website: n.a.

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.
 Coordinator Country Spain [ES]
 Total cost 71˙429 €
 EC max contribution 50˙000 € (70%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
2. H2020-EU.2.3.1. (Mainstreaming SME support, especially through a dedicated instrument)
 Code Call H2020-SMEINST-1-2014
 Funding Scheme SME-1
 Starting year 2014
 Duration (year-month-day) from 2014-10-01   to  2014-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    PHOTONIC SENSORS AND ALGORITHMS SL ES (VALENCIA) coordinator 50˙000.00

Map

 Project objective

This proposal aims to develop miniaturized 3 Dimensional (3D) cameras for mobile phones, tablets and laptop computers; more specifically embedded camera modules providing 2D and 3D-Images, integrating image-sensing electronics and light-field optics in a single lens Wafer Level Camera (WLC). This disruptive device is aiming towards significant market-shares and global leadership in 3D-imaging camera modules, accelerating our growth and Europe´s Competitive position in Smart Cameras for 3D-imaging. We introduce a paradigm changer in one of the highest growth areas addressable in consumer technologies, setting entry barriers difficult to overcome for current and new market players; we will hit the market while established competitors will still be trying to figure out our algorithms, our IPR and our hardware solution. Our most disruptive competitive advantage is based on our algorithms, exploiting a novel hardware structure. First contacts with Taiwanese distributors and manufacturers of laptop/network/tablet computers and mobile phones allow us to think that such a disruptive device can sell millions of units. This phase-1 study will minimize technical and market acceptance risks. We extend the well-known FSV-model to FSOV (Fabless Semiconductor and Optical Vendor). Manufacturing, both for the semiconductor image sensors and for the optical layers on top of it, will be performed by third parties (silicon foundries and optical foundries). One of the main tasks of this feasibility study is to choose the best manufacturing partners from the handful of candidate companies in both sectors (silicon and optics), as well as obtaining exact quotations for the costs of the BOM (Bill of Materials); we will also visit some potential customers to verify correctness of the data (sales volumes and price targets) and build a Business Plan that will include Product Roadmap, Project Plan and Marketing and Sales Plans.

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The information about "3D-LEAP" are provided by the European Opendata Portal: CORDIS opendata.

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