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3D-LEAP

3 Dimensional Light Sensor for Advanced Portable Devices

Total Cost €

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EC-Contrib. €

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Partnership

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 Outcomes and results

 3D-LEAP project word cloud

Explore the words cloud of the 3D-LEAP project. It provides you a very rough idea of what is the project "3D-LEAP" about.

obtaining    position    2d    performed    computers    first    acute    laptop    fsv    sales    light    competitors    integrating    sensing    introduce    modules    bill    phones    miniaturized    wafer    contacts    figure    algorithms    extend    3d    camera    manufacturers    data    feasibility    device    wlc    smart    single    solution    technologies    cameras    advantage    mobile    vendor    trying    quotations    layers    millions    image    foundries    risks    hit    hardware    images    imaging    customers    entry    addressable    handful    overcome    distributors    candidate    sectors    semiconductor    ipr    minimize    shares    roadmap    lens    price    companies    fsov    plans    competitive    accelerating    think    paradigm    tablets    marketing    silicon    players    business    verify    units    plan    model    network    dimensional    structure    highest    correctness    bom    taiwanese    changer    setting    exact    disruptive    barriers    acceptance    market    leadership    visit    europe    optical    manufacturing    sell    electronics    parties    difficult    choose    sensors    materials    optics    global    tablet    fabless    volumes   

Project "3D-LEAP" data sheet

The following table provides information about the project.

Coordinator		 PHOTONIC SENSORS AND ALGORITHMS SL 

Organization address
address: CALLE GUARDIA CIVIL 23 ESC 2 10 38
city: VALENCIA
postcode: 46020
website: n.a.

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.
 Coordinator Country Spain [ES]
 Total cost 71˙429 €
 EC max contribution 50˙000 € (70%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
2. H2020-EU.2.3.1. (Mainstreaming SME support, especially through a dedicated instrument)
 Code Call H2020-SMEINST-1-2014
 Funding Scheme SME-1
 Starting year 2014
 Duration (year-month-day) from 2014-10-01   to  2014-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    PHOTONIC SENSORS AND ALGORITHMS SL ES (VALENCIA) coordinator 50˙000.00

Map

 Project objective

This proposal aims to develop miniaturized 3 Dimensional (3D) cameras for mobile phones, tablets and laptop computers; more specifically embedded camera modules providing 2D and 3D-Images, integrating image-sensing electronics and light-field optics in a single lens Wafer Level Camera (WLC). This disruptive device is aiming towards significant market-shares and global leadership in 3D-imaging camera modules, accelerating our growth and Europe´s Competitive position in Smart Cameras for 3D-imaging. We introduce a paradigm changer in one of the highest growth areas addressable in consumer technologies, setting entry barriers difficult to overcome for current and new market players; we will hit the market while established competitors will still be trying to figure out our algorithms, our IPR and our hardware solution. Our most disruptive competitive advantage is based on our algorithms, exploiting a novel hardware structure. First contacts with Taiwanese distributors and manufacturers of laptop/network/tablet computers and mobile phones allow us to think that such a disruptive device can sell millions of units. This phase-1 study will minimize technical and market acceptance risks. We extend the well-known FSV-model to FSOV (Fabless Semiconductor and Optical Vendor). Manufacturing, both for the semiconductor image sensors and for the optical layers on top of it, will be performed by third parties (silicon foundries and optical foundries). One of the main tasks of this feasibility study is to choose the best manufacturing partners from the handful of candidate companies in both sectors (silicon and optics), as well as obtaining exact quotations for the costs of the BOM (Bill of Materials); we will also visit some potential customers to verify correctness of the data (sales volumes and price targets) and build a Business Plan that will include Product Roadmap, Project Plan and Marketing and Sales Plans.

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The information about "3D-LEAP" are provided by the European Opendata Portal: CORDIS opendata.

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