Opendata, web and dolomites


3 Dimensional Light Sensor for Advanced Portable Devices

Total Cost €


EC-Contrib. €






 3D-LEAP project word cloud

Explore the words cloud of the 3D-LEAP project. It provides you a very rough idea of what is the project "3D-LEAP" about.

hardware    bom    silicon    quotations    choose    distributors    acceptance    figure    wlc    mobile    tablets    network    cameras    verify    business    highest    solution    sensing    contacts    europe    integrating    extend    competitors    parties    technologies    hit    computers    vendor    materials    phones    marketing    disruptive    taiwanese    lens    algorithms    global    optical    image    feasibility    minimize    images    modules    introduce    customers    handful    semiconductor    advantage    shares    sectors    light    miniaturized    players    market    exact    price    accelerating    laptop    plan    2d    data    manufacturers    paradigm    sell    foundries    think    electronics    obtaining    single    ipr    sensors    units    bill    changer    structure    addressable    imaging    wafer    acute    visit    correctness    3d    position    optics    trying    layers    device    fsv    performed    dimensional    risks    first    candidate    sales    fsov    manufacturing    difficult    camera    roadmap    barriers    volumes    competitive    leadership    entry    plans    fabless    setting    model    smart    companies    millions    overcome    tablet   

Project "3D-LEAP" data sheet

The following table provides information about the project.


Organization address
address: CALLE GUARDIA CIVIL 23 ESC 2 10 38
postcode: 46020
website: n.a.

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Spain [ES]
 Total cost 71˙429 €
 EC max contribution 50˙000 € (70%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
2. H2020-EU.2.3.1. (Mainstreaming SME support, especially through a dedicated instrument)
 Code Call H2020-SMEINST-1-2014
 Funding Scheme SME-1
 Starting year 2014
 Duration (year-month-day) from 2014-10-01   to  2014-12-31


Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 


 Project objective

This proposal aims to develop miniaturized 3 Dimensional (3D) cameras for mobile phones, tablets and laptop computers; more specifically embedded camera modules providing 2D and 3D-Images, integrating image-sensing electronics and light-field optics in a single lens Wafer Level Camera (WLC). This disruptive device is aiming towards significant market-shares and global leadership in 3D-imaging camera modules, accelerating our growth and Europe´s Competitive position in Smart Cameras for 3D-imaging. We introduce a paradigm changer in one of the highest growth areas addressable in consumer technologies, setting entry barriers difficult to overcome for current and new market players; we will hit the market while established competitors will still be trying to figure out our algorithms, our IPR and our hardware solution. Our most disruptive competitive advantage is based on our algorithms, exploiting a novel hardware structure. First contacts with Taiwanese distributors and manufacturers of laptop/network/tablet computers and mobile phones allow us to think that such a disruptive device can sell millions of units. This phase-1 study will minimize technical and market acceptance risks. We extend the well-known FSV-model to FSOV (Fabless Semiconductor and Optical Vendor). Manufacturing, both for the semiconductor image sensors and for the optical layers on top of it, will be performed by third parties (silicon foundries and optical foundries). One of the main tasks of this feasibility study is to choose the best manufacturing partners from the handful of candidate companies in both sectors (silicon and optics), as well as obtaining exact quotations for the costs of the BOM (Bill of Materials); we will also visit some potential customers to verify correctness of the data (sales volumes and price targets) and build a Business Plan that will include Product Roadmap, Project Plan and Marketing and Sales Plans.

Are you the coordinator (or a participant) of this project? Plaese send me more information about the "3D-LEAP" project.

For instance: the website url (it has not provided by EU-opendata yet), the logo, a more detailed description of the project (in plain text as a rtf file or a word file), some pictures (as picture files, not embedded into any word file), twitter account, linkedin page, etc.

Send me an  email ( and I put them in your project's page as son as possible.

Thanks. And then put a link of this page into your project's website.

The information about "3D-LEAP" are provided by the European Opendata Portal: CORDIS opendata.

More projects from the same programme (H2020-EU.2.1.1.;H2020-EU.2.3.1.)

Starcounter (2017)

In-Memory Computing and Artificial Intelligence Platform for Building Next Generation Enterprise Software

Read More  

scanvid (2017)

ScanVid - One-Click Integrated Access to Product-related Digital Content

Read More  


SME LOYALISER: fostering SME retailers through LOYALty Integrated SERvices

Read More