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TAPES3 SIGNED

Technology Advances for Pilotline of Enhanced Semiconductors for 3nm

Total Cost €

0

EC-Contrib. €

0

Partnership

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Project "TAPES3" data sheet

The following table provides information about the project.

Coordinator
ASML NETHERLANDS B.V. 

Organization address
address: DE RUN 6501
city: VELDHOVEN
postcode: 5504DR
website: www.asml.com

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Netherlands [NL]
 Total cost 123˙445˙881 €
 EC max contribution 28˙196˙106 € (23%)
 Programme 1. H2020-EU.2.1.1.7. (ECSEL)
 Code Call H2020-ECSEL-2017-1-IA-two-stage
 Funding Scheme ECSEL-IA
 Starting year 2018
 Duration (year-month-day) from 2018-10-01   to  2021-09-30

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    ASML NETHERLANDS B.V. NL (VELDHOVEN) coordinator 7˙501˙242.00
2    INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM BE (LEUVEN) participant 6˙175˙448.00
3    CARL ZEISS SMT GMBH DE (OBERKOCHEN) participant 4˙000˙000.00
4    APPLIED MATERIALS ISRAEL LTD IL (REHOVOT) participant 1˙462˙650.00
5    LAM RESEARCH AG AT (VILLACH) participant 1˙079˙510.00
6    NOVA MEASURING INSTRUMENTS LTD IL (REHOVOT) participant 943˙250.00
7    VDL ETG TECHNOLOGY & DEVELOPMENT BV NL (EINDHOVEN) participant 891˙603.00
8    INSTITUT FUER MIKROELEKTRONIK STUTTGART DE (STUTTGART) participant 867˙464.00
9    FEI ELECTRON OPTICS BV NL (EINDHOVEN) participant 820˙654.00
10    NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO NL (DEN HAAG) participant 761˙974.00
11    SILTRONIC AG DE (MUNCHEN) participant 515˙888.00
12    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) participant 387˙050.00
13    COVENTOR SARL FR (VILLEBON SUR YVETTE) participant 358˙802.00
14    KLA-TENCOR CORPORATION (ISRAEL) IL (MIGDAL HAEMEK) participant 346˙185.00
15    DEMCON ADVANCED MECHATRONICS ENSCHEDE B.V. NL (ENSCHEDE) participant 344˙999.00
16    ION BEAM SERVICES FR (ROUSSET) participant 274˙096.00
17    APPLIED MATERIALS BELGIUM BE (LEUVEN) participant 190˙167.00
18    PHYSIKALISCH-TECHNISCHE BUNDESANSTALT DE (BRAUNSCHWEIG) participant 187˙395.00
19    SIEMENS INDUSTRY SOFTWARE NV BE (LEUVEN) participant 183˙675.00
20    RHEINISCH-WESTFAELISCHE TECHNISCHE HOCHSCHULE AACHEN DE (AACHEN) participant 169˙905.00
21    OPTIX FAB GMBH DE (JENA) participant 168˙437.00
22    SUSS MicroTec Photomask Equipment GmbH & Co. KG DE (Sternenfels) participant 135˙867.00
23    PAUL SCHERRER INSTITUT CH (VILLIGEN PSI) participant 134˙952.00
24    RECIF TECHNOLOGIES FR (Blagnac) participant 92˙602.00
25    JSR MICRO NV BE (LEUVEN) participant 92˙061.00
26    ADVANCED MASK TECHNOLOGY CENTER GMBH & CO KG DE (DRESDEN) participant 80˙487.00
27    OXFORD INSTRUMENTS NANOTECHNOLOGY TOOLS LIMITED UK (ABINGDON) participant 29˙735.00
28    MENTOR GRAPHICS BELGIUM BE (BRUSSELS) participant 0.00

Map

 Project objective

'In line with industry needs, Moore’s law, scaling in ITRS 2013, and ECSEL JU MASP 2017, the main objective of the TAPES3 project is to discover, develop and demonstrate lithographic, metrology, EUV mask technology, devices and process modules enabling 3nm node technology. This is planned with available EUV/NA 0.33 scanners, and with system design and integration of a new hyper NA EUV lithography tool to enable more single exposure patterning at 3nm to create complex integrated circuits. Process steps for 3D devices as alternative to the conventional FINFet will be explored for application in the 3nm node. The impact of the application of these so called 3D devices on circuit topology and logic design will be explored. During the development, specific challenges in metrology for the characterization of 3D devices will be assessed and metrology tools will be newly developed. The result will be demonstrated in the imec pilot line. The TAPES3 project relates to the ECSEL work program topic Equipment, Material and Manufacturing. It addresses and targets, as set out in MASP, the grand Challange of 'More Moore Equipment and Materials for sub 10nm technologies' by exploring the requirements and solutions for the 3nm node. The project touches the core of the continuation of Moore’s law. Moreover, the cost aware development process will support the involved companies, and will place them in a preferred position over their worldwide competition. Through their worldwide affiliations, the impact of the TAPES3 project will be felt outside Europe in America and Asia Pacific semiconductor centers and is expected to benefit the European economy a lot by supporting its semiconductor equipment and metrology sectors with innovations, exports and employment.'

 Publications

year authors and title journal last update
List of publications.
2019 Bartosz Bilski, Heiko Feldmann, Paul Gräupner, Peter Kürz, Winfried Kaiser
High-NA EUV Optics –the Key for Miniaturizationof Integrated Circuitsin the Next Decade
published pages: , ISSN: , DOI:
2020-03-19
2019 Winfried Kaiser
VLSI Keynote: EUVL - Optics: Status and Future Perspectives
published pages: , ISSN: , DOI:
2020-03-19
2019 Sascha Migura
Optics for EUV Lithography
published pages: , ISSN: , DOI:
2020-03-19
2019 Heiko Feldmann, Paul Gräupner, Peter Kürz, Winfried Kaiser
High-NA EUV Optics – The key for miniaturizationof integrated circuits in the next decade
published pages: , ISSN: , DOI:
2020-03-19

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The information about "TAPES3" are provided by the European Opendata Portal: CORDIS opendata.

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