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MASSTART SIGNED

MASS manufacturing of TrAnsceiveRs for Terabit/s era

Total Cost €

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EC-Contrib. €

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Partnership

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 MASSTART project word cloud

Explore the words cloud of the MASSTART project. It provides you a very rough idea of what is the project "MASSTART" about.

masstart    assembled    line    decade    carrier    lower    fiber    glass    bit    psm4    enhanced    si    coupling    pic    improvement    dd    techniques    mid    800g    assembly    optical    closely    flow    delivering    throughput    modulation    spot    dramatically    board    transceivers    demonstrators    laser    industry    form    density    obtain    format    x6    pitch    size    3d    transformation    commercialization    compliance    interact    placement    standardization    single    wafer    data    transceiver    inter    coherent    capacity    evaluation    wdm    bonders    interface    leadership    rate    wavelength    6tb    64qam    characterization    tunable    16    surpass    minute    600gb    400g    scalable    time    aggregate    photonics    channel    threshold    mass    gb    complete    converters    operators    reduce    center    holistic    chip    photonic    flip    packaging    automated    leveraging    bodies    dp    circuits    guarantee    backside    tsv    qsfp    connection    module    metric    waveguide    compatible    speed    device    generation    international    64gbaud    tools    rapid    fabrication   

Project "MASSTART" data sheet

The following table provides information about the project.

Coordinator
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. 

Organization address
address: HANSASTRASSE 27C
city: MUNCHEN
postcode: 80686
website: www.fraunhofer.de

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Germany [DE]
 Total cost 7˙476˙435 €
 EC max contribution 5˙999˙936 € (80%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2018-2
 Funding Scheme IA
 Starting year 2019
 Duration (year-month-day) from 2019-01-01   to  2021-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) coordinator 1˙169˙375.00
2    COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES FR (PARIS 15) participant 869˙147.00
3    ADVA OPTICAL NETWORKING SE DE (MEININGEN) participant 702˙100.00
4    MELLANOX TECHNOLOGIES LTD - MLNX IL (YOKNEAM) participant 649˙092.00
5    FICONTEC SERVICE GMBH DE (ACHIM) participant 611˙362.00
6    ARISTOTELIO PANEPISTIMIO THESSALONIKIS EL (THESSALONIKI) participant 516˙250.00
7    DUSTPHOTONICS LTD IL (TEL AVIV - JAFFA) participant 459˙375.00
8    ALMAE TECHNOLOGIES FR (MARCOUSSIS) participant 406˙358.00
9    TEEM Photonics FR (MEYLAN) participant 271˙250.00
10    BRIGHT PHOTONICS BV NL (MAARSSEN) participant 172˙812.00
11    TEKTRONIX GMBH DE (KOLN) participant 172˙812.00

Map

 Project objective

MASSTART aims to provide a holistic transformation to the assembly and characterization of high speed photonic transceivers towards bringing the cost down to €1/Gb/s or even lower in mass production. This will guarantee European leadership in the Photonics industry for the next decade. MASSTART will surpass the cost metric threshold by using enhanced and scalable techniques: i) glass interface based laser/PIC and fiber/PIC coupling approaches, leveraging glass waveguide technology to obtain spot size and pitch converters in order to dramatically increase optical I/O density, while facilitating automated assembly processes, ii) 3D packaging (TSV) enabling backside connection of the high speed PIC to a Si carrier iii) a new generation of flip chip bonders with enhanced placement in a complete assembly line compatible with Industry 4.0 which will guarantee an x6 improvement in throughput and iv) wafer-level evaluation of assembled circuits with novel tools that will reduce the characterization time by a factor of 10, down to 1 minute per device. This process flow will be assessed with the fabrication and characterization of four different demonstrators, addressing the mid-term requirements of next generation transceivers required by Data Center operators and covering both inter- and intra- Data Center applications. These demonstrators are: i) a 4-channel PSM4 module in QSFP-DD format with 400G aggregate bit rate, ii) an 8-channel WDM module in a QSFP-DD format with 800G aggregate bit rate, iii) a 16-channel WDM on-board module delivering 1.6Tb/s aggregate line rate and iv) a tunable single-wavelength coherent transceiver with 600Gb/s capacity following the DP-64QAM modulation format on 64Gbaud/s line rate. Finally, MASSTART will interact closely with international bodies to ensure the compliance and standardization of the developed technology with other proposed packaging form factors for rapid commercialization.

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The information about "MASSTART" are provided by the European Opendata Portal: CORDIS opendata.

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