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MASSTART SIGNED

MASS manufacturing of TrAnsceiveRs for Terabit/s era

Total Cost €

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EC-Contrib. €

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Partnership

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 MASSTART project word cloud

Explore the words cloud of the MASSTART project. It provides you a very rough idea of what is the project "MASSTART" about.

transceiver    coupling    spot    glass    rapid    threshold    packaging    compliance    modulation    qsfp    guarantee    holistic    size    connection    dramatically    transceivers    gb    optical    lower    pic    scalable    64qam    masstart    compatible    photonics    surpass    speed    center    rate    module    16    density    characterization    format    inter    assembled    wdm    metric    assembly    flip    flow    operators    line    chip    demonstrators    delivering    device    capacity    generation    placement    tools    circuits    mass    form    x6    decade    tsv    closely    bit    dd    time    commercialization    throughput    leadership    6tb    waveguide    bodies    64gbaud    automated    laser    si    aggregate    bonders    techniques    coherent    converters    interface    wavelength    international    standardization    fiber    evaluation    3d    carrier    tunable    industry    obtain    leveraging    single    transformation    mid    800g    wafer    fabrication    channel    dp    psm4    600gb    reduce    photonic    enhanced    backside    pitch    board    interact    400g    improvement    complete    minute    data   

Project "MASSTART" data sheet

The following table provides information about the project.

Coordinator
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. 

Organization address
address: HANSASTRASSE 27C
city: MUNCHEN
postcode: 80686
website: www.fraunhofer.de

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Germany [DE]
 Total cost 7˙476˙435 €
 EC max contribution 5˙999˙936 € (80%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2018-2
 Funding Scheme IA
 Starting year 2019
 Duration (year-month-day) from 2019-01-01   to  2021-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) coordinator 1˙169˙375.00
2    COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES FR (PARIS 15) participant 869˙147.00
3    ADVA OPTICAL NETWORKING SE DE (MEININGEN) participant 702˙100.00
4    MELLANOX TECHNOLOGIES LTD - MLNX IL (YOKNEAM) participant 649˙092.00
5    FICONTEC SERVICE GMBH DE (ACHIM) participant 611˙362.00
6    ARISTOTELIO PANEPISTIMIO THESSALONIKIS EL (THESSALONIKI) participant 516˙250.00
7    DUSTPHOTONICS LTD IL (TEL AVIV - JAFFA) participant 459˙375.00
8    ALMAE TECHNOLOGIES FR (MARCOUSSIS) participant 406˙358.00
9    TEEM Photonics FR (MEYLAN) participant 271˙250.00
10    BRIGHT PHOTONICS BV NL (MAARSSEN) participant 172˙812.00
11    TEKTRONIX GMBH DE (KOLN) participant 172˙812.00

Map

 Project objective

MASSTART aims to provide a holistic transformation to the assembly and characterization of high speed photonic transceivers towards bringing the cost down to €1/Gb/s or even lower in mass production. This will guarantee European leadership in the Photonics industry for the next decade. MASSTART will surpass the cost metric threshold by using enhanced and scalable techniques: i) glass interface based laser/PIC and fiber/PIC coupling approaches, leveraging glass waveguide technology to obtain spot size and pitch converters in order to dramatically increase optical I/O density, while facilitating automated assembly processes, ii) 3D packaging (TSV) enabling backside connection of the high speed PIC to a Si carrier iii) a new generation of flip chip bonders with enhanced placement in a complete assembly line compatible with Industry 4.0 which will guarantee an x6 improvement in throughput and iv) wafer-level evaluation of assembled circuits with novel tools that will reduce the characterization time by a factor of 10, down to 1 minute per device. This process flow will be assessed with the fabrication and characterization of four different demonstrators, addressing the mid-term requirements of next generation transceivers required by Data Center operators and covering both inter- and intra- Data Center applications. These demonstrators are: i) a 4-channel PSM4 module in QSFP-DD format with 400G aggregate bit rate, ii) an 8-channel WDM module in a QSFP-DD format with 800G aggregate bit rate, iii) a 16-channel WDM on-board module delivering 1.6Tb/s aggregate line rate and iv) a tunable single-wavelength coherent transceiver with 600Gb/s capacity following the DP-64QAM modulation format on 64Gbaud/s line rate. Finally, MASSTART will interact closely with international bodies to ensure the compliance and standardization of the developed technology with other proposed packaging form factors for rapid commercialization.

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The information about "MASSTART" are provided by the European Opendata Portal: CORDIS opendata.

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