Opendata, web and dolomites

MASSTART SIGNED

MASS manufacturing of TrAnsceiveRs for Terabit/s era

Total Cost €

0

EC-Contrib. €

0

Partnership

0

Views

0

 MASSTART project word cloud

Explore the words cloud of the MASSTART project. It provides you a very rough idea of what is the project "MASSTART" about.

reduce    threshold    automated    line    600gb    x6    characterization    tools    metric    data    device    transceiver    transformation    compliance    industry    pic    operators    400g    techniques    mid    flip    3d    waveguide    time    compatible    flow    tsv    demonstrators    mass    commercialization    glass    evaluation    inter    single    size    spot    optical    center    dd    converters    transceivers    dramatically    density    pitch    surpass    wavelength    dp    wdm    coupling    speed    minute    16    assembled    backside    wafer    leadership    obtain    tunable    masstart    photonics    fabrication    bodies    assembly    placement    packaging    bit    fiber    throughput    holistic    complete    form    rate    module    bonders    closely    si    lower    standardization    modulation    capacity    photonic    chip    scalable    international    board    format    gb    laser    64gbaud    improvement    64qam    rapid    interact    aggregate    leveraging    enhanced    qsfp    circuits    carrier    generation    guarantee    delivering    channel    connection    psm4    interface    decade    coherent    800g    6tb   

Project "MASSTART" data sheet

The following table provides information about the project.

Coordinator
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. 

Organization address
address: HANSASTRASSE 27C
city: MUNCHEN
postcode: 80686
website: www.fraunhofer.de

contact info
title: n.a.
name: n.a.
surname: n.a.
function: n.a.
email: n.a.
telephone: n.a.
fax: n.a.

 Coordinator Country Germany [DE]
 Total cost 7˙476˙435 €
 EC max contribution 5˙999˙936 € (80%)
 Programme 1. H2020-EU.2.1.1. (INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT))
 Code Call H2020-ICT-2018-2
 Funding Scheme IA
 Starting year 2019
 Duration (year-month-day) from 2019-01-01   to  2021-12-31

 Partnership

Take a look of project's partnership.

# participants  country  role  EC contrib. [€] 
1    FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. DE (MUNCHEN) coordinator 1˙169˙375.00
2    COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES FR (PARIS 15) participant 869˙147.00
3    ADVA OPTICAL NETWORKING SE DE (MEININGEN) participant 702˙100.00
4    MELLANOX TECHNOLOGIES LTD - MLNX IL (YOKNEAM) participant 649˙092.00
5    FICONTEC SERVICE GMBH DE (ACHIM) participant 611˙362.00
6    ARISTOTELIO PANEPISTIMIO THESSALONIKIS EL (THESSALONIKI) participant 516˙250.00
7    DUSTPHOTONICS LTD IL (TEL AVIV - JAFFA) participant 459˙375.00
8    ALMAE TECHNOLOGIES FR (MARCOUSSIS) participant 406˙358.00
9    TEEM Photonics FR (MEYLAN) participant 271˙250.00
10    BRIGHT PHOTONICS BV NL (MAARSSEN) participant 172˙812.00
11    TEKTRONIX GMBH DE (KOLN) participant 172˙812.00

Map

 Project objective

MASSTART aims to provide a holistic transformation to the assembly and characterization of high speed photonic transceivers towards bringing the cost down to €1/Gb/s or even lower in mass production. This will guarantee European leadership in the Photonics industry for the next decade. MASSTART will surpass the cost metric threshold by using enhanced and scalable techniques: i) glass interface based laser/PIC and fiber/PIC coupling approaches, leveraging glass waveguide technology to obtain spot size and pitch converters in order to dramatically increase optical I/O density, while facilitating automated assembly processes, ii) 3D packaging (TSV) enabling backside connection of the high speed PIC to a Si carrier iii) a new generation of flip chip bonders with enhanced placement in a complete assembly line compatible with Industry 4.0 which will guarantee an x6 improvement in throughput and iv) wafer-level evaluation of assembled circuits with novel tools that will reduce the characterization time by a factor of 10, down to 1 minute per device. This process flow will be assessed with the fabrication and characterization of four different demonstrators, addressing the mid-term requirements of next generation transceivers required by Data Center operators and covering both inter- and intra- Data Center applications. These demonstrators are: i) a 4-channel PSM4 module in QSFP-DD format with 400G aggregate bit rate, ii) an 8-channel WDM module in a QSFP-DD format with 800G aggregate bit rate, iii) a 16-channel WDM on-board module delivering 1.6Tb/s aggregate line rate and iv) a tunable single-wavelength coherent transceiver with 600Gb/s capacity following the DP-64QAM modulation format on 64Gbaud/s line rate. Finally, MASSTART will interact closely with international bodies to ensure the compliance and standardization of the developed technology with other proposed packaging form factors for rapid commercialization.

Are you the coordinator (or a participant) of this project? Plaese send me more information about the "MASSTART" project.

For instance: the website url (it has not provided by EU-opendata yet), the logo, a more detailed description of the project (in plain text as a rtf file or a word file), some pictures (as picture files, not embedded into any word file), twitter account, linkedin page, etc.

Send me an  email (fabio@fabiodisconzi.com) and I put them in your project's page as son as possible.

Thanks. And then put a link of this page into your project's website.

The information about "MASSTART" are provided by the European Opendata Portal: CORDIS opendata.

More projects from the same programme (H2020-EU.2.1.1.)

SODALITE (2019)

SOftware Defined AppLication Infrastructures managemenT and Engineering

Read More  

5G-DIVE (2019)

5G-DIVE: eDge Intelligence for Vertical Experimentation

Read More  

PILOTING (2020)

PILOTs for robotic INspection and maintenance Grounded on advanced intelligent platforms and prototype applications

Read More